Katsuhiko HIDAKA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation sheet, heat dissipation member, and semiconductor...
- Patent number 11,834,603
- Issue date Dec 5, 2023
- Mitsubishi Chemical Corporation
- Toshiyuki Sawamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET,...
- Publication number 20250019489
- Publication date Jan 16, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Toshiyuki TANAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT DISSIPATION SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR...
- Publication number 20200407618
- Publication date Dec 31, 2020
- MITSUBISHI CHEMICAL CORPORATION
- Toshiyuki SAWAMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...