Katsuhiko Horigome

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive tape for semiconductor processing, and semiconductor devic...
- Patent number 11,183,416
- Issue date Nov 23, 2021
- Lintec Corporation
- Kazuto Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape for semiconductor processing and method for producing...
- Patent number 10,879,104
- Issue date Dec 29, 2020
- Lintec Corporation
- Tomochika Tominaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film for semiconductors, semiconductor device, and compo...
- Patent number 10,825,790
- Issue date Nov 3, 2020
- Lintec Corporation
- Naoya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape for semiconductor processing and method for producing...
- Patent number 10,460,973
- Issue date Oct 29, 2019
- Lintec Corporation
- Tomochika Tominaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sheet having adhesive resin layer attached thereto, and method for...
- Patent number 10,086,594
- Issue date Oct 2, 2018
- Lintec Corporation
- Katsuhiko Horigome
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor wafer protection structure and laminated protective s...
- Patent number 7,361,971
- Issue date Apr 22, 2008
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensitive adhesive double coated sheet and method of use t...
- Patent number 7,105,226
- Issue date Sep 12, 2006
- Lintec Corporation
- Hayato Noguchi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Adhesive Tape for Semiconductor Processing, and Semiconductor Devic...
- Publication number 20190382633
- Publication date Dec 19, 2019
- LINTEC CORPORATION
- Kazuto AIZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING...
- Publication number 20190385889
- Publication date Dec 19, 2019
- LINTEC Corporation
- Tomochika TOMINAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING...
- Publication number 20180308739
- Publication date Oct 25, 2018
- Lintec Corporation
- Tomochika TOMINAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE, AND COMPO...
- Publication number 20180138141
- Publication date May 17, 2018
- LINTEC CORPORATION
- Naoya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet Having Adhesive Resin Layer Attached Thereto, and Method for...
- Publication number 20150165743
- Publication date Jun 18, 2015
- LINTEC CORPORATION
- Katsuhiko Horigome
- B32 - LAYERED PRODUCTS
Information Patent Application
Protective structure of semiconductor wafer, method for protecting...
- Publication number 20060043532
- Publication date Mar 2, 2006
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure sensitive adhesive double coated sheet and method of use t...
- Publication number 20030029544
- Publication date Feb 13, 2003
- LINTEC CORPORATION
- Hayato Noguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Katsuhiko Horigome

Person

Patents Grantslast 30 patents

Adhesive tape for semiconductor processing, and semiconductor devic...

Adhesive tape for semiconductor processing and method for producing...

Protective film for semiconductors, semiconductor device, and compo...

Adhesive tape for semiconductor processing and method for producing...

Sheet having adhesive resin layer attached thereto, and method for...

Semiconductor wafer protection structure and laminated protective s...

Pressure sensitive adhesive double coated sheet and method of use t...

Patents Applicationslast 30 patents

Adhesive Tape for Semiconductor Processing, and Semiconductor Devic...

ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING...

ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING...

PROTECTIVE FILM FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE, AND COMPO...

Sheet Having Adhesive Resin Layer Attached Thereto, and Method for...

Protective structure of semiconductor wafer, method for protecting...

Pressure sensitive adhesive double coated sheet and method of use t...