Katsuhiko NAWATE

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Prepreg, laminate, printed wiring board, coreless substrate, semico...
- Patent number 11,214,660
- Issue date Jan 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless substrate prepreg, coreless substrate, coreless substrate...
- Patent number 10,681,807
- Issue date Jun 9, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko Sakamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PREPREG, LAMINATE, PRINTED WIRING BOARD, CORELESS SUBSTRATE, SEMICO...
- Publication number 20200239653
- Publication date Jul 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuma YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...
- Publication number 20200107437
- Publication date Apr 2, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko SAKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTO...
- Publication number 20200056006
- Publication date Feb 20, 2020
- Hitachi Chemical Company, Ltd.
- Hiroshi YOKOTA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...