Katsuhiko Oyama

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
- Patent number 9,202,768
- Issue date Dec 1, 2015
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,338,287
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Masayuki Miura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,205,670
- Issue date Apr 17, 2007
- Kabushiki Kaisha Toshiba
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated-chip semiconductor device
- Patent number 6,861,738
- Issue date Mar 1, 2005
- Kabushiki Kaisha Toshiba
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,617,678
- Issue date Sep 9, 2003
- Kabushiki Kaisha Toshiba
- Takashi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device of surface mounting type and method for fabric...
- Patent number 6,429,372
- Issue date Aug 6, 2002
- Kabushiki Kaisha Toshiba
- Hideo Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 5,677,246
- Issue date Oct 14, 1997
- Kabushiki Kaisha Toshiba
- Hideaki Maeta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140252588
- Publication date Sep 11, 2014
- Kabushiki Kaisha Toshiba
- Hideo AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110233793
- Publication date Sep 29, 2011
- Masayuki MIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount type semiconductor device and method of manufacturing...
- Publication number 20060270118
- Publication date Nov 30, 2006
- Hiroyuki Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20040115863
- Publication date Jun 17, 2004
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020195698
- Publication date Dec 26, 2002
- Takashi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated-chip semiconductor device
- Publication number 20020180030
- Publication date Dec 5, 2002
- KABUSHIKI KAISHA TOAHIBA
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS