Katsuhiko Suzuki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
- Patent number 11,819,975
- Issue date Nov 21, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Peeling method for peeling off substrate from support plate
- Patent number 11,764,066
- Issue date Sep 19, 2023
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing and resin grinding apparatus
- Patent number 11,574,804
- Issue date Feb 7, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Carrier plate removing method
- Patent number 11,538,710
- Issue date Dec 27, 2022
- Disco Corporation
- Takatoshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing carrier plate
- Patent number 11,222,808
- Issue date Jan 11, 2022
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing molded chip
- Patent number 11,205,580
- Issue date Dec 21, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device with metal film
- Patent number 11,164,783
- Issue date Nov 2, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method
- Patent number 11,153,975
- Issue date Oct 19, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peeling method for peeling off substrate from support plate
- Patent number 10,998,196
- Issue date May 4, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier plate removing method
- Patent number 10,933,618
- Issue date Mar 2, 2021
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Removal method of carrier plate
- Patent number 10,926,524
- Issue date Feb 23, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier plate removing method
- Patent number 10,804,131
- Issue date Oct 13, 2020
- Disco Corporation
- Hayato Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 10,629,445
- Issue date Apr 21, 2020
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device chip and method of manufacturing semiconductor...
- Patent number 10,325,858
- Issue date Jun 18, 2019
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device including electromagnetic wave shield...
- Patent number 10,269,724
- Issue date Apr 23, 2019
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer manufacturing method
- Patent number 10,115,644
- Issue date Oct 30, 2018
- Disco Corporation
- Katsuhiko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing SiC wafer
- Patent number 10,056,263
- Issue date Aug 21, 2018
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,887,091
- Issue date Feb 6, 2018
- Disco Corporation
- Katsuhiko Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a three-dimensional packaging semiconductor...
- Patent number 8,956,915
- Issue date Feb 17, 2015
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink set, ink jet recording method and ink jet recording apparatus
- Patent number 8,469,504
- Issue date Jun 25, 2013
- Canon Kabushiki Kaisha
- Takashi Saito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ink jet recording method, and ink jet recording apparatus
- Patent number 8,389,600
- Issue date Mar 5, 2013
- Canon Kabushiki Kaisha
- Katsuhiko Suzuki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Waste ink absorbent member, and waste ink container and ink jet rec...
- Patent number 8,353,573
- Issue date Jan 15, 2013
- Canon Kabushiki Kaisha
- Koichi Osumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device
- Patent number 8,338,940
- Issue date Dec 25, 2012
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waste ink absorbent member, and waste ink container and ink jet rec...
- Patent number 8,152,273
- Issue date Apr 10, 2012
- Canon Kabushiki Kaisha
- Koichi Osumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Device having electronic components mounted therein and method for...
- Patent number 8,120,921
- Issue date Feb 21, 2012
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pigment ink, ink jet recording method, ink cartridge, recording uni...
- Patent number 7,918,928
- Issue date Apr 5, 2011
- Canon Kabushiki Kaisha
- Takashi Saito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aqueous ink, ink jet recording method, ink cartridge, recording uni...
- Patent number 7,868,060
- Issue date Jan 11, 2011
- Canon Kabushiki Kaisha
- Junichi Sakai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic device test system
- Patent number 7,859,286
- Issue date Dec 28, 2010
- Advantest Corporation
- Katsuhiko Suzuki
- G01 - MEASURING TESTING
Information Patent Grant
Silver halide photographic emulsion
- Patent number 6,808,871
- Issue date Oct 26, 2004
- Konica Corporation
- Katsuhiko Suzuki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Silver halide photographic emulsion
- Patent number 6,623,917
- Issue date Sep 23, 2003
- Konica Corporation
- Katsuhiko Suzuki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR DEVICE CHIP
- Publication number 20220399235
- Publication date Dec 15, 2022
- Disco Corporation
- Katsuhiko SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER PLATE REMOVING METHOD
- Publication number 20220028723
- Publication date Jan 27, 2022
- Disco Corporation
- Takatoshi SAKURAI
- B32 - LAYERED PRODUCTS
Information Patent Application
PEELING METHOD FOR PEELING OFF SUBSTRATE FROM SUPPORT PLATE
- Publication number 20210175085
- Publication date Jun 10, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL METHOD OF CARRIER PLATE
- Publication number 20210060921
- Publication date Mar 4, 2021
- Disco Corporation
- Katsuhiko SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING CARRIER PLATE
- Publication number 20210066110
- Publication date Mar 4, 2021
- Disco Corporation
- Katsuhiko SUZUKI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING MOLDED CHIP
- Publication number 20200373172
- Publication date Nov 26, 2020
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER PLATE REMOVING METHOD
- Publication number 20200230936
- Publication date Jul 23, 2020
- Disco Corporation
- Katsuhiko SUZUKI
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH METAL FILM
- Publication number 20200144120
- Publication date May 7, 2020
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD MANUFACTURING METHOD
- Publication number 20200146158
- Publication date May 7, 2020
- Disco Corporation
- Katsuhiko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE MATERIAL MANUFACTURING METHOD AND COPPER-CLAD LAMINATE MANUFAC...
- Publication number 20200146153
- Publication date May 7, 2020
- Disco Corporation
- Katsuhiko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER PLATE REMOVING METHOD
- Publication number 20200051847
- Publication date Feb 13, 2020
- Disco Corporation
- Hayato KIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING METHOD FOR PEELING OFF SUBSTRATE FROM SUPPORT PLATE
- Publication number 20190267245
- Publication date Aug 29, 2019
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS
- Publication number 20190206673
- Publication date Jul 4, 2019
- Disco Corporation
- Shinya WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE PROCESSING APPARATUS
- Publication number 20190198357
- Publication date Jun 27, 2019
- Disco Corporation
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CORE MATERIAL AND METHOD OF MANUFACTURING...
- Publication number 20190144619
- Publication date May 16, 2019
- Disco Corporation
- Katsuhiko SUZUKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20190006185
- Publication date Jan 3, 2019
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CHIP AND METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20180197823
- Publication date Jul 12, 2018
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER MANUFACTURING METHOD
- Publication number 20180166355
- Publication date Jun 14, 2018
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SiC WAFER
- Publication number 20170301549
- Publication date Oct 19, 2017
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20170236786
- Publication date Aug 17, 2017
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INK JET INK, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNI...
- Publication number 20160280945
- Publication date Sep 29, 2016
- Canon Kabushiki Kaisha
- Fumihiko Mukae
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20150332909
- Publication date Nov 19, 2015
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130078764
- Publication date Mar 28, 2013
- NEC AccessTechnica, Ltd.
- Takao YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WASTE INK ABSORBENT MEMBER, AND WASTE INK CONTAINER AND INK JET REC...
- Publication number 20120218345
- Publication date Aug 30, 2012
- Canon Kabushiki Kaisha
- Koichi Osumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PR...
- Publication number 20110031610
- Publication date Feb 10, 2011
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR...
- Publication number 20100188821
- Publication date Jul 29, 2010
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INK SET, INK JET RECORDING METHOD AND INK JET RECORDING APPARATUS
- Publication number 20100033522
- Publication date Feb 11, 2010
- Canon Kabushiki Kaisha
- Takashi Saito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INK SET, INK JET RECORDING METHOD, AND INK JET RECORDING APPARATUS
- Publication number 20100033523
- Publication date Feb 11, 2010
- Canon Kabushiki Kaisha
- Katsuhiko Suzuki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INK JET INK, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNI...
- Publication number 20100034972
- Publication date Feb 11, 2010
- Canon Kabushiki Kaisha
- Fumihiko Mukae
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WASTE INK ABSORBENT MEMBER, AND WASTE INK CONTAINER AND INK JET REC...
- Publication number 20090231388
- Publication date Sep 17, 2009
- Canon Kabushiki Kaisha
- Koichi Osumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Katsuhiko Suzuki

Person

Patents Grantslast 30 patents

Workpiece processing apparatus including a resin coater and a resin...

Peeling method for peeling off substrate from support plate

Workpiece processing and resin grinding apparatus

Carrier plate removing method

Method of removing carrier plate

Method of manufacturing molded chip

Manufacturing method of semiconductor device with metal film

Wiring board manufacturing method

Peeling method for peeling off substrate from support plate

Carrier plate removing method

Removal method of carrier plate

Carrier plate removing method

Wafer processing method

Semiconductor device chip and method of manufacturing semiconductor...

Semiconductor package device including electromagnetic wave shield...

Interposer manufacturing method

Method of processing SiC wafer

Wafer processing method

Method of manufacturing a three-dimensional packaging semiconductor...

Ink set, ink jet recording method and ink jet recording apparatus

Ink jet recording method, and ink jet recording apparatus

Waste ink absorbent member, and waste ink container and ink jet rec...

Semiconductor device

Waste ink absorbent member, and waste ink container and ink jet rec...

Device having electronic components mounted therein and method for...

Pigment ink, ink jet recording method, ink cartridge, recording uni...

Aqueous ink, ink jet recording method, ink cartridge, recording uni...

Electronic device test system

Silver halide photographic emulsion

Silver halide photographic emulsion

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR DEVICE CHIP

CARRIER PLATE REMOVING METHOD

PEELING METHOD FOR PEELING OFF SUBSTRATE FROM SUPPORT PLATE

REMOVAL METHOD OF CARRIER PLATE

METHOD OF REMOVING CARRIER PLATE

METHOD OF MANUFACTURING MOLDED CHIP

CARRIER PLATE REMOVING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH METAL FILM

WIRING BOARD MANUFACTURING METHOD

CORE MATERIAL MANUFACTURING METHOD AND COPPER-CLAD LAMINATE MANUFAC...

CARRIER PLATE REMOVING METHOD

PEELING METHOD FOR PEELING OFF SUBSTRATE FROM SUPPORT PLATE

WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS

WORKPIECE PROCESSING APPARATUS

METHOD OF MANUFACTURING CORE MATERIAL AND METHOD OF MANUFACTURING...

WAFER PROCESSING METHOD

SEMICONDUCTOR DEVICE CHIP AND METHOD OF MANUFACTURING SEMICONDUCTOR...

INTERPOSER MANUFACTURING METHOD

METHOD OF PROCESSING SiC WAFER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

INK JET INK, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNI...

WAFER PROCESSING METHOD

SEMICONDUCTOR DEVICE

WASTE INK ABSORBENT MEMBER, AND WASTE INK CONTAINER AND INK JET REC...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PR...

DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR...

INK SET, INK JET RECORDING METHOD AND INK JET RECORDING APPARATUS

INK SET, INK JET RECORDING METHOD, AND INK JET RECORDING APPARATUS

INK JET INK, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNI...

WASTE INK ABSORBENT MEMBER, AND WASTE INK CONTAINER AND INK JET REC...