Katsuhiro Ishida

Person

Mie-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 10,170,284
- Issue date Jan 1, 2019
- Tokyo Electron Limited
- Kenta Yasuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,237,295
- Issue date Aug 7, 2012
- Kabushiki Kaisha Toshiba
- Yuichi Sano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 8,231,046
- Issue date Jul 31, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor device and method of manufacturing the same
- Patent number 8,039,970
- Issue date Oct 18, 2011
- Kabushiki Kaisha Toshiba
- Kazuhiro Yamamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and semiconductor memory device
- Patent number 7,968,993
- Issue date Jun 28, 2011
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory preventing an electric short circuit between a...
- Patent number 7,795,667
- Issue date Sep 14, 2010
- Kabushiki Kaisha Toshiba
- Tadashi Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stack chip package with wired bonded chips
- Patent number 7,755,175
- Issue date Jul 13, 2010
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multilayer wiring structure
- Patent number 7,719,117
- Issue date May 18, 2010
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device having multilayer wiring...
- Patent number 7,268,069
- Issue date Sep 11, 2007
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20170004956
- Publication date Jan 5, 2017
- TOKYO ELECTRON LIMITED
- Kenta YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING PATTERN IN CONDUCTIVE L...
- Publication number 20160268294
- Publication date Sep 15, 2016
- KABUSHIKI KAISHA TOSHIBA
- Junichi HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130062758
- Publication date Mar 14, 2013
- Kabushiki Kaisha Toshiba
- Takashi IMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20110309502
- Publication date Dec 22, 2011
- Kabushiki Kaisha Toshiba
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100255637
- Publication date Oct 7, 2010
- KABUSHIKI KAISHA TOSHIBA
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100181367
- Publication date Jul 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100009513
- Publication date Jan 14, 2010
- KABUSHIKI KAISHA TOSHIBA
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE
- Publication number 20090014894
- Publication date Jan 15, 2009
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080179757
- Publication date Jul 31, 2008
- Kabushiki Kaisha Toshiba
- Kazuhiro YAMAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20080099532
- Publication date May 1, 2008
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE
- Publication number 20080036089
- Publication date Feb 14, 2008
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070102801
- Publication date May 10, 2007
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060237754
- Publication date Oct 26, 2006
- KABUSHIKI KAISHA TOSHIBA
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having multilayer wiring structure and method...
- Publication number 20050167843
- Publication date Aug 4, 2005
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with element isolation region and method of fa...
- Publication number 20050167745
- Publication date Aug 4, 2005
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040099900
- Publication date May 27, 2004
- Tadashi Iguchi
- H01 - BASIC ELECTRIC ELEMENTS

Katsuhiro Ishida

Person

Patents Grantslast 30 patents

Plasma processing method and plasma processing apparatus

Semiconductor device, method for manufacturing semiconductor device...

Wire bonding apparatus and wire bonding method

Stacked semiconductor device and method of manufacturing the same

Stacked semiconductor device and semiconductor memory device

Semiconductor memory preventing an electric short circuit between a...

Multi-stack chip package with wired bonded chips

Semiconductor device having multilayer wiring structure

Method of fabricating semiconductor device having multilayer wiring...

Patents Applicationslast 30 patents

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING PATTERN IN CONDUCTIVE L...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE

STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device having multilayer wiring structure and method...

Semiconductor device with element isolation region and method of fa...

Semiconductor device and method of manufacturing the same