Katsuhiro Iwashita

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bump forming method and apparatus therefor
- Patent number 6,460,755
- Issue date Oct 8, 2002
- Hitachi, Ltd.
- Kosuke Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR