Katsuhisa Ookawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for inspecting connection state of electronic part and a sub...
- Patent number 6,428,202
- Issue date Aug 6, 2002
- NEC Corporation
- Hideo Mitsuhashi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor wafer polishing end point detection method and apparatus
- Publication number 20020013007
- Publication date Jan 31, 2002
- NEC Corporation
- Koichi Hasegawa
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer polishing endpoint detecting system and method...
- Publication number 20010036676
- Publication date Nov 1, 2001
- NEC Corporation
- Hideo Mitsuhashi
- B24 - GRINDING POLISHING