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Katsuhisa Tanabe

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electroless palladium plating solution
    • Patent number 11,946,144
    • Issue date Apr 2, 2024
    • C. Uyemura & Co., Ltd.
    • Tsuyoshi Maeda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Palladium plating solution and plating method
    • Patent number 11,814,717
    • Issue date Nov 14, 2023
    • C. Uyemura & Co., Ltd.
    • Yohei Kaneko
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless palladium plating solution and palladium film
    • Patent number 11,492,706
    • Issue date Nov 8, 2022
    • C. Uyemura & Co., Ltd.
    • Tetsuya Sasamura
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating bath
    • Patent number 10,975,475
    • Issue date Apr 13, 2021
    • C. Uyemura & Co., Ltd.
    • Yohei Kaneko
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Film formation method
    • Patent number 10,941,493
    • Issue date Mar 9, 2021
    • C. Uyemura & Co., Ltd.
    • Katsuhisa Tanabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electroless platinum plating bath
    • Patent number 10,822,704
    • Issue date Nov 3, 2020
    • C. Uyemura & Co., Ltd.
    • Tetsuya Sasamura
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating bath, electroless gold plating method and...
    • Patent number 7,985,285
    • Issue date Jul 26, 2011
    • C. Uyemura & Co., Ltd.
    • Masayuki Kiso
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLU...
    • Publication number 20240360586
    • Publication date Oct 31, 2024
    • C. Uyemura & Co., Ltd.
    • Takuya OKAMACHI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    CATALYST APPLICATION BATH FOR ELECTROLESS PLATING, METHOD OF PRODUC...
    • Publication number 20240200196
    • Publication date Jun 20, 2024
    • C. Uyemura & Co., Ltd.
    • Naoki Nakano
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ETCHANT AND METHOD OF SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY
    • Publication number 20230407487
    • Publication date Dec 21, 2023
    • C. Uyemura & Co., Ltd.
    • Takuma Maekawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    REGENERATION METHOD FOR GOLD PLATING SOLUTION
    • Publication number 20230203665
    • Publication date Jun 29, 2023
    • C. Uyemura & Co., Ltd.
    • Yohei KANEKO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METAL DISPLACEMENT SOLUTION, METHOD FOR SURFACE TREATMENT OF ALUMIN...
    • Publication number 20230151493
    • Publication date May 18, 2023
    • C. Uyemura & Co., Ltd.
    • Takuma Maekawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTROLESS GOLD PLATING BATH
    • Publication number 20230111446
    • Publication date Apr 13, 2023
    • C. Uyemura & Co., Ltd.
    • Sayuri TANAKA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR FABRICATING ELECTRONIC COMPONENT
    • Publication number 20220396881
    • Publication date Dec 15, 2022
    • C. Uyemura & Co., Ltd.
    • Yohei KANEKO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    MULTILAYER PLATING FILM
    • Publication number 20220388279
    • Publication date Dec 8, 2022
    • C. Uyemura & Co., Ltd.
    • Katsuhisa TANABE
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    ELECTROLESS PALLADIUM PLATING BATH
    • Publication number 20220033973
    • Publication date Feb 3, 2022
    • C. Uyemura & Co., Ltd.
    • Takuma MAEKAWA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Palladium Plating Solution And Plating Method
    • Publication number 20210310127
    • Publication date Oct 7, 2021
    • C. Uyemura & Co., Ltd.
    • Yohei Kaneko
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTROLESS PALLADIUM PLATING SOLUTION AND PALLADIUM FILM
    • Publication number 20210054508
    • Publication date Feb 25, 2021
    • C. Uyemura & Co., Ltd.
    • Tetsuya SASAMURA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    GOLD PLATING METHOD AND PLATING FILM
    • Publication number 20200340120
    • Publication date Oct 29, 2020
    • C. Uyemura & Co., Ltd.
    • Tsuyoshi MAEDA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTROLESS PALLADIUM PLATING SOLUTION
    • Publication number 20200318239
    • Publication date Oct 8, 2020
    • C. Uyemura & Co., Ltd.
    • Tsuyoshi MAEDA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTROLESS GOLD PLATING BATH
    • Publication number 20200283906
    • Publication date Sep 10, 2020
    • C. Uyemura & Co., Ltd.
    • Yohei KANEKO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTROLESS PALLADIUM PLATING SOLUTION, AND ELECTROLESS PALLADIUM P...
    • Publication number 20200248312
    • Publication date Aug 6, 2020
    • C. Uyemura & Co., Ltd.
    • Tsuyoshi MAEDA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    FILM FORMATION METHOD
    • Publication number 20190345612
    • Publication date Nov 14, 2019
    • C. Uyemura & Co., Ltd.
    • Katsuhisa TANABE
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTROLESS PLATINUM PLATING BATH
    • Publication number 20190309423
    • Publication date Oct 10, 2019
    • C. UYEMURA & CO., LTD
    • Tetsuya SASAMURA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Electroless gold plating bath, electroless gold plating method and...
    • Publication number 20080138506
    • Publication date Jun 12, 2008
    • C. Uyemura & Co., Ltd.
    • Masayuki Kiso
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...