Katsuichi Kimura

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Iruma-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball and electronic member
- Patent number 9,320,152
- Issue date Apr 19, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball for semiconductor packaging and electronic member using...
- Patent number 9,024,442
- Issue date May 5, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball and electronic member having solder bump
- Patent number 8,501,088
- Issue date Aug 6, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Takayuki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BALL AND ELECTRONIC MEMBER
- Publication number 20150146394
- Publication date May 28, 2015
- NIPPON STEEL & SUMKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING...
- Publication number 20120223430
- Publication date Sep 6, 2012
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISI...
- Publication number 20120038042
- Publication date Feb 16, 2012
- NIPPON MICROMETAL CORPORATION
- Tsutomu Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP
- Publication number 20090196789
- Publication date Aug 6, 2009
- Nippon Steel Materials Co., Ltd.
- Takayuki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR