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Katsuji Inagaki
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Hiratsuka-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Noble metal paste for bonding of semiconductor element
Patent number
10,366,963
Issue date
Jul 30, 2019
Tanaka Kikinzoku Kogyo K.K.
Masayuki Miyairi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Precious metal paste for bonding semiconductor element
Patent number
9,539,671
Issue date
Jan 10, 2017
Tanaka Kikinzoku K.K.
Masayuki Miyairi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT
Publication number
20130168437
Publication date
Jul 4, 2013
Masayuki Miyairi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR