Katsuji Komatsu

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process for the production of high-density printed wiring board
- Patent number 7,140,103
- Issue date Nov 28, 2006
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board for semiconductor plastic package
- Patent number 6,479,760
- Issue date Nov 12, 2002
- Mitsubishi Gas Chemical Company, Inc.
- Hidenori Kimbara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array type printed wiring board having exellent heat diff...
- Patent number 6,396,143
- Issue date May 28, 2002
- Mitsubishi Gas Chemical Company, Inc.
- Hidenori Kimbara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board for semiconductor plastic package
- Patent number 6,362,436
- Issue date Mar 26, 2002
- Mitsubishi Gas Chemical Company, Inc.
- Hidenori Kimbara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for the production of high-density printed wiring board
- Publication number 20030049913
- Publication date Mar 13, 2003
- Morio Gaku
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board for semiconductor plastic package
- Publication number 20020039644
- Publication date Apr 4, 2002
- Hidenori Kimbara
- H01 - BASIC ELECTRIC ELEMENTS