Katsumi Kakamu

Person

Kasugai, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with copper wirings having improved negative b...
- Patent number 7,030,498
- Issue date Apr 18, 2006
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wirings
- Patent number 6,885,105
- Issue date Apr 26, 2005
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 6,878,619
- Issue date Apr 12, 2005
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,794,693
- Issue date Sep 21, 2004
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lamination structure with copper wiring and its manufacture method
- Patent number 6,777,323
- Issue date Aug 17, 2004
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer interconnection structure
- Patent number 6,455,444
- Issue date Sep 24, 2002
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer interconnection structure
- Patent number 6,211,570
- Issue date Apr 3, 2001
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of making a semiconductor device with residual amine group f...
- Publication number 20090149031
- Publication date Jun 11, 2009
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with copper wirings
- Publication number 20050029671
- Publication date Feb 10, 2005
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050012122
- Publication date Jan 20, 2005
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040041267
- Publication date Mar 4, 2004
- FUJITSU LIMITED
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030227087
- Publication date Dec 11, 2003
- FUJITSU LIMITED
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor device
- Publication number 20030216052
- Publication date Nov 20, 2003
- FUJITSU LIMITED
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with copper wirings
- Publication number 20030183939
- Publication date Oct 2, 2003
- FUJITSU LIMITED
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lamination structure with copper wiring and its manufacture method
- Publication number 20030176063
- Publication date Sep 18, 2003
- FUJITSU LIMITED
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device having silicon carbide...
- Publication number 20030068582
- Publication date Apr 10, 2003
- FUJITSU LIMITED
- Daisuke Komada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multilayer interconnection structure
- Publication number 20010005037
- Publication date Jun 28, 2001
- FUJITSU LIMITED
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS

Katsumi Kakamu

Person

Patents Grantslast 30 patents

Semiconductor device with copper wirings having improved negative b...

Semiconductor device with copper wirings

Method for fabricating semiconductor device

Semiconductor device and manufacturing method thereof

Lamination structure with copper wiring and its manufacture method

Semiconductor device having a multilayer interconnection structure

Semiconductor device having a multilayer interconnection structure

Patents Applicationslast 30 patents

Method of making a semiconductor device with residual amine group f...

Semiconductor device with copper wirings

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Method for fabricating semiconductor device

Semiconductor device with copper wirings

Lamination structure with copper wiring and its manufacture method

Method of manufacturing semiconductor device having silicon carbide...

Semiconductor device having a multilayer interconnection structure