Katsumi Rikimaru

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Yokohama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for evaluating semiconductor material
- Patent number 7,145,658
- Issue date Dec 5, 2006
- Kabushiki Kaisha Toshiba
- Haruko Akutsu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for evaluating semiconductor material
- Publication number 20040196464
- Publication date Oct 7, 2004
- Haruko Akutsu
- G01 - MEASURING TESTING