Katsumi Shimada

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Transparent epoxy resin composition for molding optical semiconduct...
- Patent number 7,880,279
- Issue date Feb 1, 2011
- Nitto Denko Corporation
- Kenji Uchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, and semico...
- Patent number 7,265,167
- Issue date Sep 4, 2007
- Nitto Denko Corporation
- Shinya Akizuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing epoxy resin composition for photosemiconducto...
- Patent number 6,713,571
- Issue date Mar 30, 2004
- Nitto Denki Corporation
- Katsumi Shimada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Transparent resin plate from epoxy resin and anhydride or partial e...
- Patent number 6,667,078
- Issue date Dec 23, 2003
- Nitto Denko Corporation
- Katsumi Shimada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Casting from epoxy resin and anhydride (partial ester)
- Patent number 6,407,183
- Issue date Jun 18, 2002
- Nitto Denko Corporation
- Katsumi Shimada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for encapsulating photosemiconductor elemen...
- Patent number 6,221,510
- Issue date Apr 24, 2001
- Nitto Denko Corporation
- Masato Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Modified alkyl-terminated encapsulant for semiconductor of epoxy re...
- Patent number 6,001,483
- Issue date Dec 14, 1999
- Nitto Denko Corporation
- Tadaaki Harada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosemiconductor device and epoxy resin composition for use in mo...
- Patent number 5,107,327
- Issue date Apr 21, 1992
- Nitto Denko Corporation
- Syuuji Nishimori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090246918
- Publication date Oct 1, 2009
- Nitto Denko Corporation
- Hiroshi NORO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TRANSPARENT EPOXY RESIN COMPOSITION FOR MOLDING OPTICAL SEMICONDUCT...
- Publication number 20070181902
- Publication date Aug 9, 2007
- NEC ELECTRONICS CORPORATION
- Kenji UCHIDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin composition for semiconductor encapsulation, and semico...
- Publication number 20040097632
- Publication date May 20, 2004
- NITTO DENKO CORPORATION
- Shinya Akizuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin composition for casting
- Publication number 20020156204
- Publication date Oct 24, 2002
- NITTO DENKO CORPORATION
- Katsumi Shimada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for producing epoxy resin composition for photosemiconducto...
- Publication number 20020117774
- Publication date Aug 29, 2002
- NITTO DENKO CORPORATION
- Katsumi Shimada
- H01 - BASIC ELECTRIC ELEMENTS

Katsumi Shimada

Person

Patents Grantslast 30 patents

Transparent epoxy resin composition for molding optical semiconduct...

Epoxy resin composition for semiconductor encapsulation, and semico...

Process for producing epoxy resin composition for photosemiconducto...

Transparent resin plate from epoxy resin and anhydride or partial e...

Casting from epoxy resin and anhydride (partial ester)

Epoxy resin composition for encapsulating photosemiconductor elemen...

Modified alkyl-terminated encapsulant for semiconductor of epoxy re...

Photosemiconductor device and epoxy resin composition for use in mo...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

TRANSPARENT EPOXY RESIN COMPOSITION FOR MOLDING OPTICAL SEMICONDUCT...

Epoxy resin composition for semiconductor encapsulation, and semico...

Epoxy resin composition for casting

Process for producing epoxy resin composition for photosemiconducto...