Katsumi TERADA

Person

Otsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional mounting method and three-dimensional mounting de...
- Patent number 9,673,166
- Issue date Jun 6, 2017
- Toray Engineering Co., Ltd.
- Koji Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispensing device and mounting system
- Patent number 7,753,253
- Issue date Jul 13, 2010
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting system
- Patent number 7,621,969
- Issue date Nov 24, 2009
- Toray Engineering Co., Ltd.
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting device
- Patent number 7,279,358
- Issue date Oct 9, 2007
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of high-speed and accurate alignment using a chip mounting d...
- Patent number 6,961,994
- Issue date Nov 8, 2005
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240371657
- Publication date Nov 7, 2024
- TORAY ENGINEERING CO., LTD.
- Shimpei AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MOUNTING METHOD AND THREE-DIMENSIONAL MOUNTING DE...
- Publication number 20170005068
- Publication date Jan 5, 2017
- TORAY ENGINEERING CO., LTD.
- Koji NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND MOUNTING METHOD
- Publication number 20120015458
- Publication date Jan 19, 2012
- Takayoshi Akamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip Mounting Apparatus and Chip Mounting Method
- Publication number 20090289098
- Publication date Nov 26, 2009
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging system
- Publication number 20090011538
- Publication date Jan 8, 2009
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dispensing device and mounting system
- Publication number 20070111400
- Publication date May 17, 2007
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting method and mounting device
- Publication number 20060016555
- Publication date Jan 26, 2006
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-mounting device and method of alignment thereof
- Publication number 20030046812
- Publication date Mar 13, 2003
- Katsumi Terada
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and apparatus for mounting chip
- Publication number 20030022534
- Publication date Jan 30, 2003
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS

Katsumi TERADA

Person

Patents Grantslast 30 patents

Three-dimensional mounting method and three-dimensional mounting de...

Dispensing device and mounting system

Mounting system

Mounting method and mounting device

Method of high-speed and accurate alignment using a chip mounting d...

Patents Applicationslast 30 patents

MOUNTING DEVICE AND MOUNTING METHOD

MOUNTING DEVICE AND MOUNTING METHOD

THREE-DIMENSIONAL MOUNTING METHOD AND THREE-DIMENSIONAL MOUNTING DE...

MOUNTING APPARATUS AND MOUNTING METHOD

Chip Mounting Apparatus and Chip Mounting Method

Packaging system

Dispensing device and mounting system

Mounting method and mounting device

Chip-mounting device and method of alignment thereof

Method and apparatus for mounting chip