Katsumi Yamaguchi

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Beppu-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip mounting method utilizing ultrasonic vibrations
- Patent number 6,269,999
- Issue date Aug 7, 2001
- Texas Instruments Incorporated
- Tomohiro Okazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and bump formation method
- Publication number 20040229425
- Publication date Nov 18, 2004
- Katsumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and bump formation method
- Publication number 20020149118
- Publication date Oct 17, 2002
- Katsumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS