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Katsumi Yamazaki
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Nagano-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Bump structure, wiring substrate, semiconductor apparatus and bump...
Patent number
9,485,864
Issue date
Nov 1, 2016
Shinko Electric Industries Co., Ltd.
Kei Imafuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing multilayer interconnection board
Patent number
7,438,945
Issue date
Oct 21, 2008
Shinko Electric Industries Co., Ltd.
Shigetsugu Muramatsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer interconnection board and production method thereof
Patent number
7,183,196
Issue date
Feb 27, 2007
Shinko Electric Industries Co., Ltd.
Shigetsugu Muramatsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP...
Publication number
20150029689
Publication date
Jan 29, 2015
Shinko Electric Industries Co., Ltd.
Kei IMAFUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTERNAL CONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE, AND METHOD...
Publication number
20070126108
Publication date
Jun 7, 2007
Shinko Electric Industries Co., Ltd.
Katsumi Yamazaki
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method of producing multilayer interconnection board
Publication number
20050158455
Publication date
Jul 21, 2005
Shigetsugu Muramatsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer interconnection board and production method thereof
Publication number
20050146038
Publication date
Jul 7, 2005
Shigetsugu Muramatsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR