Katsunori Asai

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,256,875
- Issue date Jul 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device laminated printed circuit boards
- Patent number 6,005,289
- Issue date Dec 21, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chip
- Patent number 5,814,883
- Issue date Sep 29, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 5,666,008
- Issue date Sep 9, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS