Katsuo Honda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing machine for polishing periphery of sheet
- Patent number 6,913,526
- Issue date Jul 5, 2005
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization apparatus with grinding and etching devices and holdi...
- Patent number 6,752,701
- Issue date Jun 22, 2004
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B24 - GRINDING POLISHING
Information Patent Grant
Surface machining method and apparatus
- Patent number 6,042,459
- Issue date Mar 28, 2000
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B24 - GRINDING POLISHING
Information Patent Grant
Surface machining method and apparatus
- Patent number 6,030,278
- Issue date Feb 29, 2000
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B24 - GRINDING POLISHING
Information Patent Grant
Surface grinding method and apparatus
- Patent number 5,816,895
- Issue date Oct 6, 1998
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B24 - GRINDING POLISHING
Information Patent Grant
Surface machining method and apparatus
- Patent number 5,791,976
- Issue date Aug 11, 1998
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for slicing semiconductor wafers
- Patent number 5,524,604
- Issue date Jun 11, 1996
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of chamfering semiconductor wafer
- Patent number 5,295,331
- Issue date Mar 22, 1994
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for dressing an inner peripheral blade in a slici...
- Patent number 5,000,156
- Issue date Mar 19, 1991
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for cutting a cylindrical material
- Patent number 4,903,681
- Issue date Feb 27, 1990
- Tokyo Seimitus Co., Ltd.
- Katsuo Honda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for slicing a wafer
- Patent number 4,894,956
- Issue date Jan 23, 1990
- Tokyo Semitsu Co., Ltd.
- Katsuo Honda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for slicing a wafer
- Patent number 4,852,304
- Issue date Aug 1, 1989
- Tokyo Seimtsu Co., Ltd.
- Katsuo Honda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Internal peripheral edge type blade holding device
- Patent number 4,838,238
- Issue date Jun 13, 1989
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Sheet peripheral edge grinder
- Publication number 20020164934
- Publication date Nov 7, 2002
- Katsuo Honda
- B24 - GRINDING POLISHING

Katsuo Honda

Person

Patents Grantslast 30 patents

Polishing machine for polishing periphery of sheet

Planarization apparatus with grinding and etching devices and holdi...

Surface machining method and apparatus

Surface machining method and apparatus

Surface grinding method and apparatus

Surface machining method and apparatus

Method and apparatus for slicing semiconductor wafers

Method of chamfering semiconductor wafer

Method and device for dressing an inner peripheral blade in a slici...

Method and apparatus for cutting a cylindrical material

Apparatus and method for slicing a wafer

Apparatus and method for slicing a wafer

Internal peripheral edge type blade holding device

Patents Applicationslast 30 patents

Sheet peripheral edge grinder