Katsura HAYASHI

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cutting tool and method of manufacturing machined product
- Patent number 10,792,738
- Issue date Oct 6, 2020
- KYOCERA Corporation
- Katsura Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tip and drill
- Patent number 10,744,575
- Issue date Aug 18, 2020
- KYOCERA Corporation
- Katsura Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and mounting structure using the same
- Patent number 9,936,583
- Issue date Apr 3, 2018
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, mounting structure equipped with the wiring board, an...
- Patent number 9,814,136
- Issue date Nov 7, 2017
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, component embedded substrate, and package structure
- Patent number 9,807,874
- Issue date Oct 31, 2017
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, mounting structure using same, and method of manufact...
- Patent number 9,693,451
- Issue date Jun 27, 2017
- KYOCERA Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and mounting: structure including the same
- Patent number 9,578,738
- Issue date Feb 21, 2017
- KYOCERA Corporation
- Takeshi Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for circuit board used in electronic devices and method f...
- Patent number 9,485,877
- Issue date Nov 1, 2016
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,165,849
- Issue date Oct 20, 2015
- Kyocera Corporation
- Hidefumi Hatanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate, laminated board and laminated sheet
- Patent number 8,975,537
- Issue date Mar 10, 2015
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and electronic device using the same
- Patent number 8,975,529
- Issue date Mar 10, 2015
- Kyocera Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and mounting structure thereof
- Patent number 8,802,996
- Issue date Aug 12, 2014
- KYOCERA Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate, laminated board and laminated sheet
- Patent number 8,461,462
- Issue date Jun 11, 2013
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and mounting structure
- Patent number 8,446,734
- Issue date May 21, 2013
- Kyocera Corporation
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board, mounting structure, and method for manufacturing cir...
- Patent number 8,431,832
- Issue date Apr 30, 2013
- Kyocera Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical waveguide member, optical wiring board, optical wiring modu...
- Patent number 8,045,829
- Issue date Oct 25, 2011
- Kyocera Corporation
- Katsura Hayashi
- G02 - OPTICS
Information Patent Grant
Fiber-reinforced resin and method for manufacturing the same
- Patent number 8,012,561
- Issue date Sep 6, 2011
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductor components
- Patent number 7,271,476
- Issue date Sep 18, 2007
- Kyocera Corporation
- Hiroyuki Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer sheet and production method of the same and wiring board a...
- Patent number 6,936,336
- Issue date Aug 30, 2005
- Kyocera Corporation
- Takahiro Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film with metal foil
- Patent number 6,866,739
- Issue date Mar 15, 2005
- Kyocera Corporation
- Akihiko Nishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring substrate
- Patent number 6,663,946
- Issue date Dec 16, 2003
- Kyocera Corporation
- Takuji Seri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable sheet for circuit transfer
- Patent number 6,455,784
- Issue date Sep 24, 2002
- Asahi Kasei Kabushiki Kaisha
- Shozo Kinoshita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Film with metal foil
- Patent number 6,451,441
- Issue date Sep 17, 2002
- Kyocera Corporation
- Akihiko Nishimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic wiring substrate and method of producing the same
- Patent number 6,413,620
- Issue date Jul 2, 2002
- Kyocera Corporation
- Tetsuya Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric element incorporating wiring board
- Patent number 6,370,013
- Issue date Apr 9, 2002
- Kyocera Corporation
- Yuji Iino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device mounting wiring board and method of producing the...
- Patent number 6,359,235
- Issue date Mar 19, 2002
- Kyocera Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 6,207,259
- Issue date Mar 27, 2001
- Kyocera Corporation
- Yuji Iino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a multi-layer wiring board
- Patent number 6,143,116
- Issue date Nov 7, 2000
- Kyocera Corporation
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic material reinforced by the incorporation of TiC, TiCN and T...
- Patent number 5,360,772
- Issue date Nov 1, 1994
- Kyocera Corporation
- Katsura Hayashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High-strength alumina sintered body and process for preparation the...
- Patent number 5,082,809
- Issue date Jan 21, 1992
- Kyocera Corporation
- Katsura Hayashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
TIP AND DRILL
- Publication number 20190381584
- Publication date Dec 19, 2019
- KYOCERA CORPORATION
- Katsura HAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING TOOL AND METHOD OF MANUFACTURING MACHINED PRODUCT
- Publication number 20190270150
- Publication date Sep 5, 2019
- KYOCERA CORPORATION
- Katsura HAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING TOOL TIP, CUTTING TOOL, AND METHOD FOR PRODUCING CUT WORKPI...
- Publication number 20190111496
- Publication date Apr 18, 2019
- KYOCERA CORPORATION
- Katsura HAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20160278214
- Publication date Sep 22, 2016
- KYOCERA CORPORATION
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, AND MOUNTING STRUCTURE AND LAMINATED SHEET USING THE...
- Publication number 20160242283
- Publication date Aug 18, 2016
- KYOCERA CORPORATION
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING MOUNTED STRUCTURE
- Publication number 20150366077
- Publication date Dec 17, 2015
- KYOCERA CORPORATION
- Shinya KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MOUNTING STRUCTURE EQUIPPED WITH THE WIRING BOARD, AN...
- Publication number 20150305154
- Publication date Oct 22, 2015
- KYOCERA CORPORATION
- Katsura HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE INCLUDING THE SAME
- Publication number 20150296613
- Publication date Oct 15, 2015
- KYOCERA CORPORATION
- Takeshi Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACT...
- Publication number 20150037611
- Publication date Feb 5, 2015
- KYOCERA CORPORATION
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, COMPONENT EMBEDDED SUBSTRATE, AND PACKAGE STRUCTURE
- Publication number 20140226290
- Publication date Aug 14, 2014
- KYOCERA CORPORATION
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET
- Publication number 20130256018
- Publication date Oct 3, 2013
- Katsura HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130250527
- Publication date Sep 26, 2013
- KYOCERA CORPORATION
- Hidefumi Hatanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE THEREOF
- Publication number 20130153279
- Publication date Jun 20, 2013
- KYOCERA CORPORATION
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING SHEET, METHOD OF MANUFACTURING THE SAME, AND METHOD OF M...
- Publication number 20130149514
- Publication date Jun 13, 2013
- KYOCERA CORPORATION
- Katsura HAYASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
Wire Substrate Structure
- Publication number 20130043067
- Publication date Feb 21, 2013
- Kyocera Corporation
- Katsura HAYASHI
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20130027895
- Publication date Jan 31, 2013
- KYOCERA CORPORATION
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120189818
- Publication date Jul 26, 2012
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120189826
- Publication date Jul 26, 2012
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND STRUCTURE USING THE SAME
- Publication number 20110232953
- Publication date Sep 29, 2011
- Kyocera Corporation
- Takeshi Oga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET
- Publication number 20110073358
- Publication date Mar 31, 2011
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board, Mounting Structure, and Method for Manufacturing Cir...
- Publication number 20110051386
- Publication date Mar 3, 2011
- KYOCERA CORPORATION
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Mounting Structure
- Publication number 20100259910
- Publication date Oct 14, 2010
- KYOCERA CORPORATION
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING RESIN SUBSTRATE
- Publication number 20100255286
- Publication date Oct 7, 2010
- Kyocera Corporation
- Keisaku MATSUMOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fiber-Reinforced Resin and Method for Manufacturing the Same
- Publication number 20100136284
- Publication date Jun 3, 2010
- KYOCERA CORPORATION
- Masaaki Harazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR ELEMENT MOUNTED STRUCTURE USING THE...
- Publication number 20100065318
- Publication date Mar 18, 2010
- Kyocera Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL WAVEGUIDE MEMBER, OPTICAL WIRING BOARD, OPTICAL WIRING MODU...
- Publication number 20100061679
- Publication date Mar 11, 2010
- Kyocera Corporation
- Katsura Hayashi
- G02 - OPTICS
Information Patent Application
Wiring Board and Semiconductor Device
- Publication number 20070285907
- Publication date Dec 13, 2007
- Kyocera Corporation
- Hiroyuki Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and semiconductor device
- Publication number 20050087850
- Publication date Apr 28, 2005
- KYOCERA CORPORATION
- Hiroyuki Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transfer sheet and production method of the same and wiring board a...
- Publication number 20030178227
- Publication date Sep 25, 2003
- KYOCERA CORPORATION
- Takahiro Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film with metal foil
- Publication number 20030034125
- Publication date Feb 20, 2003
- KYOCERA CORPORATION
- Akihiko Nishimoto
- B32 - LAYERED PRODUCTS

Katsura HAYASHI

Person

Patents Grantslast 30 patents

Cutting tool and method of manufacturing machined product

Tip and drill

Wiring board and mounting structure using the same

Wiring board, mounting structure equipped with the wiring board, an...

Wiring substrate, component embedded substrate, and package structure

Wiring board, mounting structure using same, and method of manufact...

Wiring board and mounting: structure including the same

Structure for circuit board used in electronic devices and method f...

Electronic device

Circuit substrate, laminated board and laminated sheet

Interposer and electronic device using the same

Wiring board and mounting structure thereof

Circuit substrate, laminated board and laminated sheet

Circuit board and mounting structure

Circuit board, mounting structure, and method for manufacturing cir...

Optical waveguide member, optical wiring board, optical wiring modu...

Fiber-reinforced resin and method for manufacturing the same

Wiring substrate for mounting semiconductor components

Transfer sheet and production method of the same and wiring board a...

Film with metal foil

Multi-layer wiring substrate

Curable sheet for circuit transfer

Film with metal foil

Ceramic wiring substrate and method of producing the same

Electric element incorporating wiring board

Electrical device mounting wiring board and method of producing the...

Wiring board

Process for producing a multi-layer wiring board

Ceramic material reinforced by the incorporation of TiC, TiCN and T...

High-strength alumina sintered body and process for preparation the...

Patents Applicationslast 30 patents

TIP AND DRILL

CUTTING TOOL AND METHOD OF MANUFACTURING MACHINED PRODUCT

CUTTING TOOL TIP, CUTTING TOOL, AND METHOD FOR PRODUCING CUT WORKPI...

WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME

WIRING BOARD, AND MOUNTING STRUCTURE AND LAMINATED SHEET USING THE...

METHOD FOR PRODUCING MOUNTED STRUCTURE

WIRING BOARD, MOUNTING STRUCTURE EQUIPPED WITH THE WIRING BOARD, AN...

WIRING BOARD AND MOUNTING STRUCTURE INCLUDING THE SAME

WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACT...

WIRING SUBSTRATE, COMPONENT EMBEDDED SUBSTRATE, AND PACKAGE STRUCTURE

CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET

ELECTRONIC DEVICE

WIRING BOARD AND MOUNTING STRUCTURE THEREOF

INSULATING SHEET, METHOD OF MANUFACTURING THE SAME, AND METHOD OF M...

Wire Substrate Structure

INTERPOSER AND ELECTRONIC DEVICE USING THE SAME

STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND STRUCTURE USING THE SAME

CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET

Circuit Board, Mounting Structure, and Method for Manufacturing Cir...

Circuit Board and Mounting Structure

METHOD FOR MANUFACTURING RESIN SUBSTRATE

Fiber-Reinforced Resin and Method for Manufacturing the Same

CIRCUIT BOARD AND SEMICONDUCTOR ELEMENT MOUNTED STRUCTURE USING THE...

OPTICAL WAVEGUIDE MEMBER, OPTICAL WIRING BOARD, OPTICAL WIRING MODU...

Wiring Board and Semiconductor Device

Wiring board and semiconductor device

Transfer sheet and production method of the same and wiring board a...

Film with metal foil