Katsushi Terajima

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,325,841
- Issue date Jun 18, 2019
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin an...
- Patent number 7,799,852
- Issue date Sep 21, 2010
- NEC Corporation
- Yukihiro Kiuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flame-retardant epoxy resin composition and semiconductor device ma...
- Patent number 7,098,276
- Issue date Aug 29, 2006
- NEC Corporation
- Yukihiro Kiuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cavity down mounting seam-welding ceramic package for semiconductor...
- Patent number 5,527,992
- Issue date Jun 18, 1996
- NEC Corporation
- Katsushi Terajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin paste for tight sealing
- Patent number 5,284,899
- Issue date Feb 8, 1994
- Sumitomo Bakelite Company Limited
- Sueo Morishige
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180374788
- Publication date Dec 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flame retardant epoxy resin composition and semiconductor device us...
- Publication number 20060247393
- Publication date Nov 2, 2006
- NEC Corporation
- Yukihiro Kiuichi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...