Katsutomo Nikaido

Person

Iruma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board having an electromagnetic wave shielding layer
- Patent number 5,416,667
- Issue date May 16, 1995
- Nippon CMK Corp.
- Junichi Ichikawa
- F42 - AMMUNITION BLASTING
Information Patent Grant
Printed circuit board having an electromagnetic shielding layer
- Patent number 5,293,004
- Issue date Mar 8, 1994
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having through-holes covered with ink layer an...
- Patent number 5,266,748
- Issue date Nov 30, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board shielded from electromagnetic wave
- Patent number 5,262,596
- Issue date Nov 16, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electromagnetic wave shield printed wir...
- Patent number 5,236,736
- Issue date Aug 17, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with electromagnetic wave shielding layer
- Patent number 5,210,379
- Issue date May 11, 1993
- Nippon CMK Corp.
- Hirotaka Okonogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 5,195,238
- Issue date Mar 23, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting an electromagnetic wave shielding layer with...
- Patent number 5,196,230
- Issue date Mar 23, 1993
- Nippon CMK Corp.
- Hirotaka Okonogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 5,112,648
- Issue date May 12, 1992
- Nippon CMK Corp.
- Hirotaka Okonogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having electromagnetic wave shielding layer
- Patent number 5,025,116
- Issue date Jun 18, 1991
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 4,900,602
- Issue date Feb 13, 1990
- Nippon CMK Corp.
- Shin Kawakami
- H01 - BASIC ELECTRIC ELEMENTS

Katsutomo Nikaido

Person

Patents Grantslast 30 patents

Printed wiring board having an electromagnetic wave shielding layer

Printed circuit board having an electromagnetic shielding layer

Printed wiring board having through-holes covered with ink layer an...

Printed wiring board shielded from electromagnetic wave

Method for manufacturing an electromagnetic wave shield printed wir...

Printed wiring board with electromagnetic wave shielding layer

Method of manufacturing a printed circuit board

Method for connecting an electromagnetic wave shielding layer with...

Method of manufacturing a printed circuit board

Printed wiring board having electromagnetic wave shielding layer

Printed wiring board