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Adhesive and semiconductor devices
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Patent number 6,750,550
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Issue date Jun 15, 2004
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Adhesive and semiconductor devices
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Patent number 6,720,083
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Issue date Apr 13, 2004
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Semiconductor devices
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Patent number 6,498,400
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Issue date Dec 24, 2002
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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H01 - BASIC ELECTRIC ELEMENTS
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Adhesive and semiconductor devices
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Patent number 6,410,642
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Issue date Jun 25, 2002
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Dow Corning Toray Silicone Co., Ltd.
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Kimio Yamakawa
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Method for the formation of silica thin films
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Patent number 6,191,183
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Issue date Feb 20, 2001
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Dow Corning Toray Silicone Co., Ltd.
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Akihiko Kobayashi
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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