Katsuya FUKASE

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer substrate and method for manufacturing multi-layer subs...
- Patent number 11,289,403
- Issue date Mar 29, 2022
- Shinko Electric Industries Co., Ltd.
- Misaki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board having two insulating films and hole penetrating there...
- Patent number 11,152,293
- Issue date Oct 19, 2021
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,892,217
- Issue date Jan 12, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Takashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 10,707,178
- Issue date Jul 7, 2020
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component-embedded board
- Patent number 10,510,638
- Issue date Dec 17, 2019
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,398,027
- Issue date Aug 27, 2019
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier base material-added wiring substrate
- Patent number 10,340,214
- Issue date Jul 2, 2019
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-embedded substrate and electronic component de...
- Patent number 10,321,574
- Issue date Jun 11, 2019
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,109,580
- Issue date Oct 23, 2018
- Shinko Electric Industries Co., Ltd.
- Shunichiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,080,292
- Issue date Sep 18, 2018
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-embedded board and electronic component device
- Patent number 10,080,293
- Issue date Sep 18, 2018
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,966,331
- Issue date May 8, 2018
- Shinko Electric Industries Co., Ltd.
- Takayuki Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,961,785
- Issue date May 1, 2018
- Shinko Electric Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 9,961,767
- Issue date May 1, 2018
- SHINKO ELECTRIC INDUSTIRES CO., LTD.
- Kazuhiro Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier base material-added wiring substrate
- Patent number 9,905,504
- Issue date Feb 27, 2018
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Careless wiring substrate having an insulation layer with a bulged...
- Patent number 9,799,595
- Issue date Oct 24, 2017
- Shinko Electric Industries Co., Ltd.
- Hiroshi Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,433,109
- Issue date Aug 30, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,420,696
- Issue date Aug 16, 2016
- Shinko Electric Industries Co., Ltd.
- Takayuki Kiwanami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method of wiring substrate
- Patent number 9,313,894
- Issue date Apr 12, 2016
- Shinko Electric Industries Co., Ltd.
- Takayuki Kiwanami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 9,313,904
- Issue date Apr 12, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 9,253,897
- Issue date Feb 2, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method of wiring substrate
- Patent number 9,232,657
- Issue date Jan 5, 2016
- Shinko Electric Industries Co., Ltd.
- Takayuki Kiwanami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 8,186,053
- Issue date May 29, 2012
- Fujitsu Limited
- Kishio Yokouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 8,166,648
- Issue date May 1, 2012
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 8,161,636
- Issue date Apr 24, 2012
- Fujitsu Limited
- Kishio Yokouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming resist pattern, method for producing circuit boa...
- Patent number 8,143,533
- Issue date Mar 27, 2012
- Mitsubishi Paper Mills Limited
- Yasuo Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of wiring board
- Patent number 8,066,862
- Issue date Nov 29, 2011
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 7,999,193
- Issue date Aug 16, 2011
- Shinko Electric Industries, Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board manufacturing method and circuit board
- Patent number 7,679,004
- Issue date Mar 16, 2010
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metal plate pattern and circuit board
- Patent number 7,454,832
- Issue date Nov 25, 2008
- Shinko Electric Industries Co., Ltd.
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTI-LAYER SUBS...
- Publication number 20200219794
- Publication date Jul 9, 2020
- Shinko Electric Industries Co., Ltd.
- Misaki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20200105651
- Publication date Apr 2, 2020
- Shinko Electric Industries Co., Ltd.
- Kazuhiro OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20200043841
- Publication date Feb 6, 2020
- Shinko Electric Industries Co., Ltd.
- Takashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20190378804
- Publication date Dec 12, 2019
- Shinko Electric Industries Co., Ltd.
- Junji SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20190181084
- Publication date Jun 13, 2019
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED BOARD
- Publication number 20190103335
- Publication date Apr 4, 2019
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND ELECTRONIC COMPONENT DE...
- Publication number 20180098430
- Publication date Apr 5, 2018
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER BASE MATERIAL-ADDED WIRING SUBSTRATE
- Publication number 20180090426
- Publication date Mar 29, 2018
- Shinko Electric Industries Co., Ltd.
- JUNJI SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20180047661
- Publication date Feb 15, 2018
- Shinko Electric Industries Co., Ltd.
- Kazuhiro OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20180042115
- Publication date Feb 8, 2018
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20180014407
- Publication date Jan 11, 2018
- Shinko Electric Industries Co., Ltd.
- Junji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20170179022
- Publication date Jun 22, 2017
- Shinko Electric Industries Co., Ltd.
- Shunichiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20170125333
- Publication date May 4, 2017
- Shinko Electric Industries Co., LTD.
- HIROSHI TOMIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20160276255
- Publication date Sep 22, 2016
- Shinko Electric Industries Co., Ltd.
- Takayuki Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20160234932
- Publication date Aug 11, 2016
- Shinko Electric Industries Co., Ltd.
- Kazuhiro OSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20160081194
- Publication date Mar 17, 2016
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Wiring Substrate
- Publication number 20150041053
- Publication date Feb 12, 2015
- Shinko Electric Industries Co., LTD.
- Takayuki Kiwanami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014020
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Board and Method of Manufacturing Wiring Board
- Publication number 20150008020
- Publication date Jan 8, 2015
- Shinko Electric Industries Co., LTD.
- Kentaro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20150009645
- Publication date Jan 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20140360765
- Publication date Dec 11, 2014
- Shinko Electric Industries Co., LTD.
- Takayuki KIWANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20140360760
- Publication date Dec 11, 2014
- Shinko Electric Industries Co., LTD.
- Takayuki KIWANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100122843
- Publication date May 20, 2010
- Fujitsu Limited
- Kishio YOKOUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Resist Pattern, Method for Producing Circuit Boa...
- Publication number 20090236137
- Publication date Sep 24, 2009
- Yasuo Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090218122
- Publication date Sep 3, 2009
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Method of Wiring Board
- Publication number 20090188806
- Publication date Jul 30, 2009
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090095521
- Publication date Apr 16, 2009
- Fujitsu Limited
- Kishio YOKOUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090095520
- Publication date Apr 16, 2009
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board manufacturing method and circuit board
- Publication number 20070181994
- Publication date Aug 9, 2007
- SHINKO ELECTRIC INDUSTRIES CO., LTD
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming metal plate pattern and circuit board
- Publication number 20070042585
- Publication date Feb 22, 2007
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Katsuya FUKASE

Person

Patents Grantslast 30 patents

Multi-layer substrate and method for manufacturing multi-layer subs...

Wiring board having two insulating films and hole penetrating there...

Wiring substrate and semiconductor device

Wiring substrate

Electronic component-embedded board

Wiring board

Carrier base material-added wiring substrate

Electronic component-embedded substrate and electronic component de...

Wiring board and semiconductor device

Wiring board

Electronic component-embedded board and electronic component device

Wiring substrate and semiconductor device

Wiring substrate and semiconductor device

Circuit board and method of manufacturing circuit board

Carrier base material-added wiring substrate

Careless wiring substrate having an insulation layer with a bulged...

Wiring substrate and semiconductor package

Method of manufacturing wiring substrate

Wiring substrate and manufacturing method of wiring substrate

Wiring board and method of manufacturing wiring board

Wiring substrate and method for manufacturing the same

Wiring substrate and manufacturing method of wiring substrate

Circuit board and method of manufacturing the same

Method of manufacturing a wiring substrate

Circuit board and method of manufacturing the same

Method for forming resist pattern, method for producing circuit boa...

Manufacturing method of wiring board

Wiring substrate and method of manufacturing the same

Circuit board manufacturing method and circuit board

Method of forming metal plate pattern and circuit board

Patents Applicationslast 30 patents

MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTI-LAYER SUBS...

WIRING BOARD

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE

WIRING BOARD

ELECTRONIC COMPONENT-EMBEDDED BOARD

ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND ELECTRONIC COMPONENT DE...

CARRIER BASE MATERIAL-ADDED WIRING SUBSTRATE

WIRING BOARD

ELECTRONIC COMPONENT-EMBEDDED BOARD AND ELECTRONIC COMPONENT DEVICE

WIRING BOARD

WIRING BOARD AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

Wiring Substrate and Semiconductor Device

Method of Manufacturing Wiring Substrate

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Wiring Board and Method of Manufacturing Wiring Board

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method for Forming Resist Pattern, Method for Producing Circuit Boa...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Manufacturing Method of Wiring Board

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Circuit board manufacturing method and circuit board

Method of forming metal plate pattern and circuit board