Katsuya Kosaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical processing method, and method of manufacturing semiconduct...
- Patent number 6,992,016
- Issue date Jan 31, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Takeo Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical processor
- Patent number 6,849,865
- Issue date Feb 1, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Takeo Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,603,190
- Issue date Aug 5, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plating semiconductor wafer and plated semiconductor wafer
- Patent number 6,500,325
- Issue date Dec 31, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,391,770
- Issue date May 21, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 6,335,265
- Issue date Jan 1, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high aspect ratio via hole including sold...
- Patent number 6,268,619
- Issue date Jul 31, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor device with heat dissipation meta...
- Patent number 6,245,596
- Issue date Jun 12, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plating semiconductor wafer and plated semiconductor wafer
- Patent number 6,210,554
- Issue date Apr 3, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus for plating a wafer
- Patent number 6,033,540
- Issue date Mar 7, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with heat dissipation metal layer and metal pr...
- Patent number 6,008,537
- Issue date Dec 28, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 5,998,238
- Issue date Dec 7, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated heat sink
- Patent number 5,872,396
- Issue date Feb 16, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for electroplating a semiconductor substrate
- Patent number 5,853,559
- Issue date Dec 29, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Tamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for adhering wafer to supporting substrate
- Patent number 5,800,667
- Issue date Sep 1, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 5,786,634
- Issue date Jul 28, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for mounting a semiconductor chip to a chip carrier by expo...
- Patent number 5,770,468
- Issue date Jun 23, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a via-hole with a void area for reduced...
- Patent number 5,483,092
- Issue date Jan 9, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of electroplating
- Patent number 5,441,629
- Issue date Aug 15, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device structure with plated heat sink and supporting...
- Patent number 5,338,967
- Issue date Aug 16, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device contact
- Patent number 5,272,111
- Issue date Dec 21, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure including bending-resistant radiatin...
- Patent number 5,200,641
- Issue date Apr 6, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chemical processing method, and method of manufacturing semiconduct...
- Publication number 20050092431
- Publication date May 5, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Takeo Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical treatment, plating, and residue elimination method
- Publication number 20040060824
- Publication date Apr 1, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating system, plating method, method of manufacturing semiconduct...
- Publication number 20020139684
- Publication date Oct 3, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Chemical treatment system
- Publication number 20020139663
- Publication date Oct 3, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Katsuya Kosaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device
- Publication number 20020048903
- Publication date Apr 25, 2002
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20010028113
- Publication date Oct 11, 2001
- Katsuya Kosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of plating semiconductor wafer and plated semiconductor wafer
- Publication number 20010000891
- Publication date May 10, 2001
- Katsuya Kosaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Katsuya Kosaki

Person

Patents Grantslast 30 patents

Chemical processing method, and method of manufacturing semiconduct...

Chemical processor

Semiconductor device

Method of plating semiconductor wafer and plated semiconductor wafer

Method of manufacturing semiconductor device

Method for manufacturing semiconductor device and semiconductor device

Semiconductor device with high aspect ratio via hole including sold...

Method of producing semiconductor device with heat dissipation meta...

Method of plating semiconductor wafer and plated semiconductor wafer

Plating apparatus for plating a wafer

Semiconductor device with heat dissipation metal layer and metal pr...

Method of fabricating semiconductor device

Semiconductor device with plated heat sink

Apparatus for electroplating a semiconductor substrate

Apparatus for adhering wafer to supporting substrate

Semiconductor device

Process for mounting a semiconductor chip to a chip carrier by expo...

Semiconductor device having a via-hole with a void area for reduced...

Apparatus and method of electroplating

Semiconductor device structure with plated heat sink and supporting...

Method for manufacturing semiconductor device contact

Semiconductor device structure including bending-resistant radiatin...

Patents Applicationslast 30 patents

Chemical processing method, and method of manufacturing semiconduct...

Chemical treatment, plating, and residue elimination method

Plating system, plating method, method of manufacturing semiconduct...

Chemical treatment system

Semiconductor device

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of plating semiconductor wafer and plated semiconductor wafer