Katsuyoshi Naoi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for analyzing electrolytic copper plating solution
- Patent number 8,440,555
- Issue date May 14, 2013
- Toppan Printing Co., Ltd.
- Toshikazu Okubo
- G01 - MEASURING TESTING
Information Patent Grant
Method for analyzing copper electroplating solution, apparatus for...
- Patent number 7,820,535
- Issue date Oct 26, 2010
- Toppan Printing Co., Ltd.
- Toshikazu Okubo
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ANALYZING ELECTROLYTIC COPPER PLATING SOLUTION
- Publication number 20110025294
- Publication date Feb 3, 2011
- Toppan Printing Co., Ltd.
- Toshikazu Okubo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for analyzing electrolytic copper plating solution, and anal...
- Publication number 20060183257
- Publication date Aug 17, 2006
- Toshikazu Okubo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR