Katsuyuki Masuda

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive agent, adhesive material using the same, and method of use...
- Patent number 10,328,683
- Issue date Jun 25, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Katsuyuki Masuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive agent, adhesive material using the same, and method of use...
- Patent number 10,322,572
- Issue date Jun 18, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Katsuyuki Masuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper metal film, method for producing same, copper metal pattern,...
- Patent number 9,457,406
- Issue date Oct 4, 2016
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Adhesive agent, adhesive material using the same, and method of use...
- Patent number 9,446,576
- Issue date Sep 20, 2016
- Hitachi Chemical Company, Ltd.
- Katsuyuki Masuda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyamideimide resin, adhesive agent, material for flexible substra...
- Patent number 8,956,732
- Issue date Feb 17, 2015
- Hitachi Chemical Company, Ltd.
- Masaki Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 8,815,334
- Issue date Aug 26, 2014
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper conductor film and manufacturing method thereof, conductive...
- Patent number 8,801,971
- Issue date Aug 12, 2014
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing slurry and polishing method
- Patent number 8,696,929
- Issue date Apr 15, 2014
- Hitachi Chemical Co., Ltd.
- Yasushi Kurata
- B24 - GRINDING POLISHING
Information Patent Grant
Silicon-containing alicyclic polyimide resin, polyamic acid resin,...
- Patent number 8,592,546
- Issue date Nov 26, 2013
- Hitachi Chemical Company, Ltd.
- Tooru Kikuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid tetracarboxylic dianhydrides and process for the preparation...
- Patent number 8,524,921
- Issue date Sep 3, 2013
- Hitachi Chemical Co., Ltd.
- Tooru Kikuchi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Primer, conductor foil with resin, laminated sheet and method of ma...
- Patent number 8,507,100
- Issue date Aug 13, 2013
- Hitachi Chemical Company, Ltd.
- Kenji Tanaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible laminate board, process for manufacturing of the board, an...
- Patent number 8,501,279
- Issue date Aug 6, 2013
- Hitachi Chemical Company, Ltd.
- Masahiko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing slurry for metal, and polishing method
- Patent number 8,486,837
- Issue date Jul 16, 2013
- Hitachi Chemical Co., Ltd.
- Hiroshi Ono
- B24 - GRINDING POLISHING
Information Patent Grant
Polyamide-imide resin, process for production of polyamide resin, a...
- Patent number 8,236,906
- Issue date Aug 7, 2012
- Hitachi Chemical Company, Ltd.
- Takako Ejiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,964,289
- Issue date Jun 21, 2011
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Prepreg for printed wiring board, metal foil clad laminate and prin...
- Patent number 7,947,332
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Prepreg, metal-clad laminate and printed circuit board using same
- Patent number 7,871,694
- Issue date Jan 18, 2011
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,862,889
- Issue date Jan 4, 2011
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer
- Patent number 7,818,877
- Issue date Oct 26, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Prepreg, metal-clad laminate and printed circuit board using same
- Patent number 7,758,951
- Issue date Jul 20, 2010
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Primer, conductor foil with resin, laminated sheet and method of ma...
- Patent number 7,648,770
- Issue date Jan 19, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,629,045
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,615,277
- Issue date Nov 10, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing fluid and polishing method
- Patent number 7,367,870
- Issue date May 6, 2008
- Hitachi Chemical Co. Ltd.
- Yasushi Kurata
- B24 - GRINDING POLISHING
Information Patent Grant
Process for the preparation of 3-(substituted phenyl)-5-alkylidene-...
- Patent number 6,090,946
- Issue date Jul 18, 2000
- Sagami Chemical Research Center
- Kenji Hirai
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Process for producing 2-(halomethyl)phenylacetic acid esters
- Patent number 5,886,211
- Issue date Mar 23, 1999
- Sagami Chemical Research Center
- Kenji Hirai
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
4-imino-oxazolidine-2-one derivatives, a process for producing such...
- Patent number 5,612,289
- Issue date Mar 18, 1997
- Sagami Chemical Research Center
- Kenji Hirai
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A COPPER WIRING PATTERN
- Publication number 20130295276
- Publication date Nov 7, 2013
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID R...
- Publication number 20130158225
- Publication date Jun 20, 2013
- Tooru Kikuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...
- Publication number 20130020021
- Publication date Jan 24, 2013
- Hitachi Chemical Company, Ltd.
- Katsuyuki MASUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...
- Publication number 20130008592
- Publication date Jan 10, 2013
- Hitachi Chemical Company, Ltd.
- Katsuyuki MASUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...
- Publication number 20130008593
- Publication date Jan 10, 2013
- Hitachi Chemical Company, Ltd.
- Katsuyuki MASUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...
- Publication number 20120315438
- Publication date Dec 13, 2012
- Kenji Tanaka
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE LAMINATE BOARD, PROCESS FOR MANUFACTURE OF THE BOARD, AND...
- Publication number 20120244275
- Publication date Sep 27, 2012
- Masahiko SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...
- Publication number 20120175147
- Publication date Jul 12, 2012
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRINTING INK, METAL NANOPARTICLES USED IN THE SAME, WIRING, CIRCUIT...
- Publication number 20120170241
- Publication date Jul 5, 2012
- Hideo Nakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...
- Publication number 20120125659
- Publication date May 24, 2012
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPA...
- Publication number 20110301362
- Publication date Dec 8, 2011
- Hitachi Chemical Company, Ltd.
- Tooru Kikuchi
- C07 - ORGANIC CHEMISTRY
Information Patent Application
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER...
- Publication number 20100243303
- Publication date Sep 30, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTIC...
- Publication number 20100233011
- Publication date Sep 16, 2010
- Hideo Nakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRA...
- Publication number 20100170701
- Publication date Jul 8, 2010
- Masaki Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...
- Publication number 20100119853
- Publication date May 13, 2010
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20100051338
- Publication date Mar 4, 2010
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20100044086
- Publication date Feb 25, 2010
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printe...
- Publication number 20090323300
- Publication date Dec 31, 2009
- Daisuke Fujimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20090145766
- Publication date Jun 11, 2009
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polishing slurry for metal, and polishing method
- Publication number 20090117829
- Publication date May 7, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi Ono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Flexible Laminate Board, Process for Manufacturing of the Board, an...
- Publication number 20090081426
- Publication date Mar 26, 2009
- Masahiko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
- Publication number 20080302558
- Publication date Dec 11, 2008
- Kazumasa TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20080138505
- Publication date Jun 12, 2008
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Polishing slurry and polishing method
- Publication number 20080003924
- Publication date Jan 3, 2008
- HITACHI CHEMICAL CO., LTD.
- Yasushi Kurata
- B24 - GRINDING POLISHING
Information Patent Application
Polishing slurry and polishing method
- Publication number 20070295934
- Publication date Dec 27, 2007
- HITACHI CHEMICAL CO., LTD.
- Yasushi Kurata
- B24 - GRINDING POLISHING
Information Patent Application
Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same
- Publication number 20070287021
- Publication date Dec 13, 2007
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20070277373
- Publication date Dec 6, 2007
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...
- Publication number 20070277375
- Publication date Dec 6, 2007
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Primer, conductor foil with resin, laminated sheet and method of ma...
- Publication number 20070185297
- Publication date Aug 9, 2007
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polishing fluid for metal, and polishing method
- Publication number 20060143990
- Publication date Jul 6, 2006
- Hiroshi Ono
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Katsuyuki Masuda

Person

Patents Grantslast 30 patents

Adhesive agent, adhesive material using the same, and method of use...

Adhesive agent, adhesive material using the same, and method of use...

Copper metal film, method for producing same, copper metal pattern,...

Adhesive agent, adhesive material using the same, and method of use...

Polyamideimide resin, adhesive agent, material for flexible substra...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Copper conductor film and manufacturing method thereof, conductive...

Polishing slurry and polishing method

Silicon-containing alicyclic polyimide resin, polyamic acid resin,...

Liquid tetracarboxylic dianhydrides and process for the preparation...

Primer, conductor foil with resin, laminated sheet and method of ma...

Flexible laminate board, process for manufacturing of the board, an...

Polishing slurry for metal, and polishing method

Polyamide-imide resin, process for production of polyamide resin, a...

Formation method of metal layer on resin layer, printed wiring boar...

Prepreg for printed wiring board, metal foil clad laminate and prin...

Prepreg, metal-clad laminate and printed circuit board using same

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer

Prepreg, metal-clad laminate and printed circuit board using same

Primer, conductor foil with resin, laminated sheet and method of ma...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer, printed wiring boar...

Polishing fluid and polishing method

Process for the preparation of 3-(substituted phenyl)-5-alkylidene-...

Process for producing 2-(halomethyl)phenylacetic acid esters

4-imino-oxazolidine-2-one derivatives, a process for producing such...

Patents Applicationslast 30 patents

METHOD FOR FORMING A COPPER WIRING PATTERN

NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID R...

ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...

ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...

ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...

PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...

FLEXIBLE LAMINATE BOARD, PROCESS FOR MANUFACTURE OF THE BOARD, AND...

COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...

PRINTING INK, METAL NANOPARTICLES USED IN THE SAME, WIRING, CIRCUIT...

COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...

NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPA...

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER...

METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTIC...

POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRA...

PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printe...

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

Polishing slurry for metal, and polishing method

Flexible Laminate Board, Process for Manufacturing of the Board, an...

PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

Polishing slurry and polishing method

Polishing slurry and polishing method

Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...

Primer, conductor foil with resin, laminated sheet and method of ma...

Polishing fluid for metal, and polishing method