Katsuyuki Yonehara

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Sagamihara-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire-pull test location identification on a wire of a microelectron...
- Patent number 9,551,640
- Issue date Jan 24, 2017
- International Business Machines Corporation
- Mark T. W. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-pull test location identification on a wire of a microelectron...
- Patent number 9,255,867
- Issue date Feb 9, 2016
- International Business Machines Corporation
- Mark T. W. Lam
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 8,952,551
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,446,735
- Issue date May 21, 2013
- International Business Machines Corporation
- Katsuyuki Yonehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab tape, method of bonding tab tape and tab tape package
- Patent number 5,394,675
- Issue date Mar 7, 1995
- International Business Machines Corp.
- Katsuyuki Yonehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab tape, method of bonding tab tape and tab tape package
- Patent number 5,243,141
- Issue date Sep 7, 1993
- IBM Corporation
- Katsuyuki Yonehara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire-Pull Test Location Identification on a Wire of a Microelectron...
- Publication number 20150377611
- Publication date Dec 31, 2015
- International Business Machines Corporation
- Mark T. W. Lam
- G01 - MEASURING TESTING
Information Patent Application
Wire-Pull Test Location Identification on a Wire of a Microelectron...
- Publication number 20150153261
- Publication date Jun 4, 2015
- International Business Machines Corporation
- Mark T. W. Lam
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Package and Method for Fabricating the Same
- Publication number 20120187562
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110199737
- Publication date Aug 18, 2011
- International Business Machines Corporation
- Katsuyuki Yonehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating the Same
- Publication number 20080237856
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS