Kaun-i Cheng

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 12,033,868
- Issue date Jul 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,728,178
- Issue date Aug 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, method for fabricating the same, and heat dissi...
- Patent number 10,950,520
- Issue date Mar 16, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,903,088
- Issue date Jan 26, 2021
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package having a protruding barri...
- Patent number 10,396,040
- Issue date Aug 27, 2019
- Siliconware Precision Industries Co., Ltd.
- Yue-Ying Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having a protruding barrier frame
- Patent number 9,997,469
- Issue date Jun 12, 2018
- Siliconware Precision Industries Co., Ltd.
- Yue-Ying Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and fabrication method thereof
- Patent number 9,171,741
- Issue date Oct 27, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210143021
- Publication date May 13, 2021
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, METHOD FOR FABRICATING THE SAME, AND HEAT DISSI...
- Publication number 20200168523
- Publication date May 28, 2020
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Yu-Lung Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180286701
- Publication date Oct 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A PROTRUDING BARRI...
- Publication number 20180261552
- Publication date Sep 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Yue-Ying Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180040568
- Publication date Feb 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Yue-Ying Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130115738
- Publication date May 9, 2013
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-mount-enhanced lead frame and method for fabricating semico...
- Publication number 20040238923
- Publication date Dec 2, 2004
- Siliconware Precision Industries Co., Ltd.
- Te-Haw Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Kaun-i Cheng

Person

Patents Grantslast 30 patents

Electronic package and method for fabricating the same

Method for fabricating electronic package

Electronic package, method for fabricating the same, and heat dissi...

Electronic package and method for fabricating the same

Method for fabricating electronic package having a protruding barri...

Electronic package having a protruding barrier frame

Packaging substrate and fabrication method thereof

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE, METHOD FOR FABRICATING THE SAME, AND HEAT DISSI...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A PROTRUDING BARRI...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

Surface-mount-enhanced lead frame and method for fabricating semico...