Kaushik Mysore

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,189,540
- Issue date Nov 30, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,164,807
- Issue date Nov 2, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 10,431,517
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20220059425
- Publication date Feb 24, 2022
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190393123
- Publication date Dec 26, 2019
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190393124
- Publication date Dec 26, 2019
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190067152
- Publication date Feb 28, 2019
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS