Kavita Shah

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
XPS metrology for process control in selective deposition
- Patent number 12,158,437
- Issue date Dec 3, 2024
- NOVA MEASURING INSTRUMENTS INC.
- Charles Larson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
XPS metrology for process control in selective deposition
- Patent number 11,680,915
- Issue date Jun 20, 2023
- NOVA MEASURING INSTRUMENTS, INC.
- Charles Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
XPS metrology for process control in selective deposition
- Patent number 11,346,795
- Issue date May 31, 2022
- NOVA MEASURING INSTRUMENTS, INC.
- Charles Thomas Larson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
XPS metrology for process control in selective deposition
- Patent number 10,801,978
- Issue date Oct 13, 2020
- NOVA MEASURING INSTRUMENTS, INC.
- Charles Thomas Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and process for plasma-enhanced atomic layer deposition
- Patent number 9,032,906
- Issue date May 19, 2015
- Applied Materials, Inc.
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for annealing a contact metal layer to form a metal silicid...
- Patent number 8,927,423
- Issue date Jan 6, 2015
- Applied Materials, Inc.
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a contact metal layer in semiconductor devices
- Patent number 8,586,479
- Issue date Nov 19, 2013
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor deposition processes for tantalum carbide nitride materials
- Patent number 7,989,339
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Kavita Shah
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ruthenium layer formation for copper film deposition
- Patent number 7,910,165
- Issue date Mar 22, 2011
- Applied Materials, Inc.
- Seshadri Ganguli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and process for plasma-enhanced atomic layer deposition
- Patent number 7,850,779
- Issue date Dec 14, 2010
- Applied Materisals, Inc.
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of recovering valuable material from exhaust gas stream of a...
- Patent number 7,833,358
- Issue date Nov 16, 2010
- Applied Materials, Inc.
- Schubert S. Chu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ruthenium or cobalt as an underlayer for tungsten film deposition
- Patent number 7,691,442
- Issue date Apr 6, 2010
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and process for plasma-enhanced atomic layer deposition
- Patent number 7,682,946
- Issue date Mar 23, 2010
- Applied Materials, Inc.
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tantalum carbide nitride materials by vapor deposition processes
- Patent number 7,678,298
- Issue date Mar 16, 2010
- Applied Materials, Inc.
- Kavita Shah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor deposition processes for tantalum carbide nitride materials
- Patent number 7,585,762
- Issue date Sep 8, 2009
- Applied Materials, Inc.
- Kavita Shah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ruthenium as an underlayer for tungsten film deposition
- Patent number 7,429,402
- Issue date Sep 30, 2008
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MEMORY STRUCTURE OF THREE-DIMENSIONAL NOR MEMORY STRINGS OF CHANNEL...
- Publication number 20250024685
- Publication date Jan 16, 2025
- Sunrise Memory Corporation
- Jie Zhou
- G11 - INFORMATION STORAGE
Information Patent Application
FABRICATION METHOD FOR A THREE-DIMENSIONAL MEMORY ARRAY OF THIN-FIL...
- Publication number 20240260275
- Publication date Aug 1, 2024
- Sunrise Memory Corporation
- Shohei Kamisaka
Information Patent Application
XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION
- Publication number 20240044825
- Publication date Feb 8, 2024
- NOVA MEASURING INSTRUMENTS INC.
- Charles LARSON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MEMORY STRUCTURE OF THREE-DIMENSIONAL NOR MEMORY STRINGS OF JUNCTIO...
- Publication number 20230262987
- Publication date Aug 17, 2023
- Sunrise Memory Corporation
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Application
XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION
- Publication number 20230021209
- Publication date Jan 19, 2023
- NOVA MEASURING INSTRUMENTS INC.
- Charles LARSON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION
- Publication number 20210025839
- Publication date Jan 28, 2021
- Nova Measuring Instruments, Inc.
- Charles Thomas Larson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION
- Publication number 20190277783
- Publication date Sep 12, 2019
- Nova Measuring Instruments, Inc.
- Charles Thomas Larson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING A CONTACT METAL LAYER IN SEMICONDUCTOR DEVICES
- Publication number 20130189840
- Publication date Jul 25, 2013
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR ANNEALING A METAL CONTACT LAYER TO FORM A METAL SILICID...
- Publication number 20130157460
- Publication date Jun 20, 2013
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR ELECTROLESS COPPER DEPOSITION ON A RUTHENIUM SEED
- Publication number 20120315756
- Publication date Dec 13, 2012
- APPLIED MATERIALS, INC.
- Timothy W. Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Vapor Deposition Processes for Tantalum Carbide Nitride Materials
- Publication number 20100129535
- Publication date May 27, 2010
- Applied Materials, Inc.
- KAVITA SHAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RUTHENIUM AS AN UNDERLAYER FOR TUNGSTEN FILM DEPOSITION
- Publication number 20090142474
- Publication date Jun 4, 2009
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TANTALUM CARBIDE NITRIDE MATERIALS BY VAPOR DEPOSITION PROCESSES
- Publication number 20090078916
- Publication date Mar 26, 2009
- APPLIED MATERIALS, INC.
- KAVITA SHAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VAPOR DEPOSITION PROCESSES FOR TANTALUM CARBIDE NITRIDE MATERIALS
- Publication number 20090081868
- Publication date Mar 26, 2009
- APPLIED MATERIALS, INC.
- KAVITA SHAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20080268171
- Publication date Oct 30, 2008
- PAUL MA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of recovering valuable material from exhaust gas stream of a...
- Publication number 20070235059
- Publication date Oct 11, 2007
- APPLIED MATERIALS, INC.
- Schubert S. Chu
- B08 - CLEANING
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070128863
- Publication date Jun 7, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070128864
- Publication date Jun 7, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070128862
- Publication date Jun 7, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070119371
- Publication date May 31, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20070119370
- Publication date May 31, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS
- Publication number 20070077750
- Publication date Apr 5, 2007
- Paul Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS
- Publication number 20070054487
- Publication date Mar 8, 2007
- APPLIED MATERIALS, INC.
- PAUL MA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for electroless copper deposition on a ruthenium seed
- Publication number 20060246699
- Publication date Nov 2, 2006
- Timothy W. Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ruthenium as an underlayer for tungsten film deposition
- Publication number 20060128150
- Publication date Jun 15, 2006
- APPLIED MATERIALS, INC.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ruthenium layer formation for copper film deposition
- Publication number 20040241321
- Publication date Dec 2, 2004
- APPLIED MATERIALS, INC.
- Seshadri Ganguli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kavita Shah

Person

Patents Grantslast 30 patents

XPS metrology for process control in selective deposition

XPS metrology for process control in selective deposition

XPS metrology for process control in selective deposition

XPS metrology for process control in selective deposition

Apparatus and process for plasma-enhanced atomic layer deposition

Methods for annealing a contact metal layer to form a metal silicid...

Methods for forming a contact metal layer in semiconductor devices

Vapor deposition processes for tantalum carbide nitride materials

Ruthenium layer formation for copper film deposition

Apparatus and process for plasma-enhanced atomic layer deposition

Method of recovering valuable material from exhaust gas stream of a...

Ruthenium or cobalt as an underlayer for tungsten film deposition

Apparatus and process for plasma-enhanced atomic layer deposition

Tantalum carbide nitride materials by vapor deposition processes

Vapor deposition processes for tantalum carbide nitride materials

Ruthenium as an underlayer for tungsten film deposition

Patents Applicationslast 30 patents

MEMORY STRUCTURE OF THREE-DIMENSIONAL NOR MEMORY STRINGS OF CHANNEL...

FABRICATION METHOD FOR A THREE-DIMENSIONAL MEMORY ARRAY OF THIN-FIL...

XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION

MEMORY STRUCTURE OF THREE-DIMENSIONAL NOR MEMORY STRINGS OF JUNCTIO...

XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION

XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION

XPS METROLOGY FOR PROCESS CONTROL IN SELECTIVE DEPOSITION

METHODS FOR FORMING A CONTACT METAL LAYER IN SEMICONDUCTOR DEVICES

METHODS FOR ANNEALING A METAL CONTACT LAYER TO FORM A METAL SILICID...

PROCESS FOR ELECTROLESS COPPER DEPOSITION ON A RUTHENIUM SEED

Vapor Deposition Processes for Tantalum Carbide Nitride Materials

RUTHENIUM AS AN UNDERLAYER FOR TUNGSTEN FILM DEPOSITION

TANTALUM CARBIDE NITRIDE MATERIALS BY VAPOR DEPOSITION PROCESSES

VAPOR DEPOSITION PROCESSES FOR TANTALUM CARBIDE NITRIDE MATERIALS

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

Method of recovering valuable material from exhaust gas stream of a...

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS

ATOMIC LAYER DEPOSITION PROCESSES FOR RUTHENIUM MATERIALS

Process for electroless copper deposition on a ruthenium seed

Ruthenium as an underlayer for tungsten film deposition

Ruthenium layer formation for copper film deposition