Kay Essig

Person

Leipzig, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,009,317
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having substrate with embedded elec...
- Patent number 11,881,448
- Issue date Jan 23, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 11,791,245
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,705,401
- Issue date Jul 18, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,682,656
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded die and manufacturing methods t...
- Patent number 8,487,426
- Issue date Jul 16, 2013
- Advanced Semiconductor Engineering, Inc.
- Kay Stephan Essig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package structure and manufacturing method thereof
- Patent number 8,309,400
- Issue date Nov 13, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240355793
- Publication date Oct 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230039430
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220367384
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359363
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220328416
- Publication date Oct 13, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220037290
- Publication date Feb 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS
- Publication number 20130037929
- Publication date Feb 14, 2013
- Kay S. Essig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Embedded Die and Manufacturing Methods T...
- Publication number 20120235309
- Publication date Sep 20, 2012
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Kay Stephan Essig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120091569
- Publication date Apr 19, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure having substrate with embedded elec...

Electronic package and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor package with embedded die and manufacturing methods t...

Leadframe package structure and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS

Semiconductor Package with Embedded Die and Manufacturing Methods T...

LEADFRAME PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF