Kay Stefan ESSIG

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package
- Patent number 11,616,007
- Issue date Mar 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,574,856
- Issue date Feb 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package structure and method for...
- Patent number 11,545,406
- Issue date Jan 3, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with wettable flank and shielding layer and manu...
- Patent number 11,462,484
- Issue date Oct 4, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,437,247
- Issue date Sep 6, 2022
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan Essig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,145,624
- Issue date Oct 12, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,978,312
- Issue date Apr 13, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device for power device
- Patent number 10,777,478
- Issue date Sep 15, 2020
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor process
- Patent number 10,217,728
- Issue date Feb 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,186,467
- Issue date Jan 22, 2019
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 9,991,193
- Issue date Jun 5, 2018
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan Essig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...
- Publication number 20220115288
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115310
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115328
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220020605
- Publication date Jan 20, 2022
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS
- Publication number 20210225746
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210028150
- Publication date Jan 28, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200350180
- Publication date Nov 5, 2020
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS
- Publication number 20190363039
- Publication date Nov 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190088506
- Publication date Mar 21, 2019
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS
- Publication number 20180145060
- Publication date May 24, 2018
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180019221
- Publication date Jan 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180019175
- Publication date Jan 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170365542
- Publication date Dec 21, 2017
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160218021
- Publication date Jul 28, 2016
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS

Kay Stefan ESSIG

Person

Patents Grantslast 30 patents

Electronic package

Semiconductor package

Substrate structure, semiconductor package structure and method for...

Electronic package with wettable flank and shielding layer and manu...

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package device for power device

Semiconductor package and semiconductor process

Semiconductor package device and method of manufacturing the same

Semiconductor device package

Patents Applicationslast 30 patents

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME