Kayo HASHIZUME

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Base material for printed circuit board and method of manufacturing...
- Patent number 12,016,132
- Issue date Jun 18, 2024
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film, substrate for printed wiring board, and printed wiring...
- Patent number 10,889,086
- Issue date Jan 12, 2021
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Substrate for printed circuit board and printed circuit board
- Patent number 10,596,782
- Issue date Mar 24, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed wiring board and method for producing the sam...
- Patent number 10,244,627
- Issue date Mar 26, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,225,931
- Issue date Mar 5, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR A PRINTED WIRING BOARD
- Publication number 20230039742
- Publication date Feb 9, 2023
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20210127487
- Publication date Apr 29, 2021
- Sumitomo Electric Industries, Ltd.
- Kenichiro AIKAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...
- Publication number 20210014978
- Publication date Jan 14, 2021
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, METHOD...
- Publication number 20210007227
- Publication date Jan 7, 2021
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...
- Publication number 20200376810
- Publication date Dec 3, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...
- Publication number 20180371191
- Publication date Dec 27, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20180147815
- Publication date May 31, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180124925
- Publication date May 3, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...
- Publication number 20170347464
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS

Kayo HASHIZUME

Person

Patents Grantslast 30 patents

Substrate for a printed wiring board

Base material for printed circuit board and method of manufacturing...

Resin film, substrate for printed wiring board, and printed wiring...

Substrate for printed circuit board and printed circuit board

Substrate for printed wiring board and method for producing the sam...

Substrate for printed circuit board, printed circuit board, and met...

Patents Applicationslast 30 patents

SUBSTRATE FOR A PRINTED WIRING BOARD

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, METHOD...

RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...

BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...

SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...