Kazuaki Kozasa

Person

Nagasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Etching method and etching apparatus of semiconductor wafer
- Patent number 9,305,850
- Issue date Apr 5, 2016
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cleaning semiconductor wafer and semiconductor wafer
- Patent number 8,992,791
- Issue date Mar 31, 2015
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of epitaxial silicon wafer and substrate clean...
- Patent number 8,696,809
- Issue date Apr 15, 2014
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Slurry supplying apparatus and method of polishing semiconductor wa...
- Patent number 8,303,373
- Issue date Nov 6, 2012
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- B24 - GRINDING POLISHING
Information Patent Grant
Etching method and etching apparatus of semiconductor wafer
- Patent number 8,273,260
- Issue date Sep 25, 2012
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rough polishing method of semiconductor wafer and polishing apparat...
- Patent number 7,666,063
- Issue date Feb 23, 2010
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rough polishing method of semiconductor wafer and polishing apparat...
- Patent number 7,540,800
- Issue date Jun 2, 2009
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method for semiconductor wafer
- Patent number 7,303,691
- Issue date Dec 4, 2007
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS OF SEMICONDUCTOR WAFER
- Publication number 20120305187
- Publication date Dec 6, 2012
- SUMCO TECHXIV CORPORATION
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER
- Publication number 20100093177
- Publication date Apr 15, 2010
- SUMCO TECHXIV CORPORATION
- Kazuaki KOZASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY SUPPLYING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WA...
- Publication number 20090298393
- Publication date Dec 3, 2009
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- B24 - GRINDING POLISHING
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS OF SEMICONDUCTOR WAFER
- Publication number 20090286333
- Publication date Nov 19, 2009
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF RECYCLING ABRASIVE SLURRY
- Publication number 20090053981
- Publication date Feb 26, 2009
- SUMCO TECHXIV CORPORATION
- Kazuaki Kozasa
- B24 - GRINDING POLISHING
Information Patent Application
ROUGH POLISHING METHOD OF SEMICONDUCTOR WAFER AND POLISHING APPARAT...
- Publication number 20090042482
- Publication date Feb 12, 2009
- SUMCO TECHXIV CORPORATION
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF EPITAXIAL SILICON WAFER AND SUBSTRATE CLEAN...
- Publication number 20080308129
- Publication date Dec 18, 2008
- EPAS
- Kazuaki KOZASA
- C30 - CRYSTAL GROWTH
Information Patent Application
Rough polishing method of semiconductor wafer and polishing apparat...
- Publication number 20080081541
- Publication date Apr 3, 2008
- SUMCO TECHXIV CORPORATION
- Kazuaki Kozasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing method for semiconductor wafer
- Publication number 20070059935
- Publication date Mar 15, 2007
- KOMATSU ELECTRONIC METALS CO., LTD.
- Kazuaki Kozasa
- B24 - GRINDING POLISHING

Kazuaki Kozasa

Person

Patents Grantslast 30 patents

Etching method and etching apparatus of semiconductor wafer

Method of cleaning semiconductor wafer and semiconductor wafer

Manufacturing method of epitaxial silicon wafer and substrate clean...

Slurry supplying apparatus and method of polishing semiconductor wa...

Etching method and etching apparatus of semiconductor wafer

Rough polishing method of semiconductor wafer and polishing apparat...

Rough polishing method of semiconductor wafer and polishing apparat...

Polishing method for semiconductor wafer

Patents Applicationslast 30 patents

ETCHING METHOD AND ETCHING APPARATUS OF SEMICONDUCTOR WAFER

METHOD OF CLEANING SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER

SLURRY SUPPLYING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WA...

ETCHING METHOD AND ETCHING APPARATUS OF SEMICONDUCTOR WAFER

METHOD OF RECYCLING ABRASIVE SLURRY

ROUGH POLISHING METHOD OF SEMICONDUCTOR WAFER AND POLISHING APPARAT...

MANUFACTURING METHOD OF EPITAXIAL SILICON WAFER AND SUBSTRATE CLEAN...

Rough polishing method of semiconductor wafer and polishing apparat...

Polishing method for semiconductor wafer