Kazuhiko Bandoh

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin mold material and resin mold
- Patent number 7,287,975
- Issue date Oct 30, 2007
- Towa Corporation
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for processing leadframe
- Patent number 6,594,889
- Issue date Jul 22, 2003
- Towa Corporation
- Kazuhiko Bandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for molding resin to seal electronic parts
- Patent number 6,007,316
- Issue date Dec 28, 1999
- Towa Corporation
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of molding resin to seal electronic parts
- Patent number 5,750,059
- Issue date May 12, 1998
- Towa Corporation
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONE...
- Publication number 20110233821
- Publication date Sep 29, 2011
- TOWA CORPORATION
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin-seal-molding electronic component and apparatus the...
- Publication number 20070069422
- Publication date Mar 29, 2007
- TOWA CORPORATION
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin mold material and resin mold
- Publication number 20040253334
- Publication date Dec 16, 2004
- TOWA CORPORATION
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL