Kazuhiko Iijima

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and manufacturing method of wiring substrate
- Patent number 10,109,571
- Issue date Oct 23, 2018
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring circuit board
- Patent number 7,671,281
- Issue date Mar 2, 2010
- Fujitsu Limited
- Toshihiro Kusagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring circuit board
- Patent number 7,253,023
- Issue date Aug 7, 2007
- Fujitsu Limited
- Toshihiro Kusagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring board and method of producing same
- Patent number 6,812,412
- Issue date Nov 2, 2004
- Fujitsu Limited
- Souichi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and method of making the same
- Patent number 6,531,661
- Issue date Mar 11, 2003
- Fujitsu Limited
- Katsumi Uchikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20170103944
- Publication date Apr 13, 2017
- Fujitsu Limited
- Kei FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring circuit board
- Publication number 20050098882
- Publication date May 12, 2005
- FUJITSU LIMITED
- Toshihiro Kusagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer wiring board and method of producing same
- Publication number 20030098179
- Publication date May 29, 2003
- FUJITSU LIMITED
- Souichi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring circuit board
- Publication number 20030063453
- Publication date Apr 3, 2003
- FUJITSU LIMITED
- Toshihiro Kusagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer printed circuit board and method of making the same
- Publication number 20020108776
- Publication date Aug 15, 2002
- FUJITSU LIMITED
- Katsumi Uchikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR