Kazuhiko KITANO

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Ishikawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 10,553,456
- Issue date Feb 4, 2020
- J-Devices Corporation
- Yasuyuki Takehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package including laser proce...
- Patent number 10,529,635
- Issue date Jan 7, 2020
- J-Devices Corporation
- Hisakazu Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,224,256
- Issue date Mar 5, 2019
- J-DEVICES CORPORATION
- Hirokazu Machida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170365534
- Publication date Dec 21, 2017
- J-DEVICES CORPORATION
- Hirokazu MACHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170358462
- Publication date Dec 14, 2017
- J-DEVICES CORPORATION
- Seita ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20170316998
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Hisakazu MARUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20170316996
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Yasuyuki TAKEHARA
- H01 - BASIC ELECTRIC ELEMENTS