Kazuhiko KURANOBU

Person

Ogaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 12,033,927
- Issue date Jul 9, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate having metal post offset from conductor pad and me...
- Patent number 11,935,822
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 11,749,444
- Issue date Sep 5, 2023
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,622,446
- Issue date Apr 4, 2023
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 11,521,786
- Issue date Dec 6, 2022
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate and method for manufacturing the same
- Patent number 11,501,909
- Issue date Nov 15, 2022
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 10,818,428
- Issue date Oct 27, 2020
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20220015234
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013409
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013455
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013448
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE
- Publication number 20210257224
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Kazuhiko KURANOBU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR BUILT-IN SUBSTRATE
- Publication number 20200335258
- Publication date Oct 22, 2020
- IBIDEN CO., LTD.
- Hiroaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INDUCTOR BUILT-IN SUBSTRATE
- Publication number 20200335277
- Publication date Oct 22, 2020
- IBIDEN CO., LTD.
- Hiroaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR BUILT-IN SUBSTRATE
- Publication number 20200335257
- Publication date Oct 22, 2020
- IBIDEN CO., LTD.
- Hiroaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200335259
- Publication date Oct 22, 2020
- IBIDEN CO., LTD.
- Hiroaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR BUILT-IN SUBSTRATE
- Publication number 20200335270
- Publication date Oct 22, 2020
- IBIDEN CO., LTD.
- Hiroaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhiko KURANOBU

Person

Patents Grantslast 30 patents

Method for manufacturing wiring substrate

Wiring substrate having metal post offset from conductor pad and me...

Inductor built-in substrate

Wiring substrate

Inductor built-in substrate

Inductor built-in substrate and method for manufacturing the same

Inductor built-in substrate

Patents Applicationslast 30 patents

WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE

INDUCTOR BUILT-IN SUBSTRATE

METHOD FOR MANUFACTURING INDUCTOR BUILT-IN SUBSTRATE

INDUCTOR BUILT-IN SUBSTRATE

INDUCTOR BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

INDUCTOR BUILT-IN SUBSTRATE