Kazuhiko Mitobe

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,528,346
- Issue date Mar 4, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for a vertically accumulable semiconductor device with ex...
- Patent number 6,433,418
- Issue date Aug 13, 2002
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device module
- Patent number 6,094,356
- Issue date Jul 25, 2000
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating solder bumps by forming solder balls with a...
- Patent number 6,025,258
- Issue date Feb 15, 2000
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor device, base member for semico...
- Patent number 6,022,759
- Issue date Feb 8, 2000
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 5,984,699
- Issue date Nov 16, 1999
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, base member for semiconductor device and semi...
- Patent number 5,747,874
- Issue date May 5, 1998
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming solder balls on a plate having apertures using...
- Patent number 5,643,831
- Issue date Jul 1, 1997
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-mounting type semiconductor package having an improved effi...
- Patent number 5,305,179
- Issue date Apr 19, 1994
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bump-forming method using two plates and electronic device
- Publication number 20010018263
- Publication date Aug 30, 2001
- Masayuki Ochiai
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhiko Mitobe

Person

Patents Grantslast 30 patents

Bump-forming method using two plates and electronic device

Apparatus for a vertically accumulable semiconductor device with ex...

Semiconductor device and semiconductor device module

Method for fabricating solder bumps by forming solder balls with a...

Method for producing a semiconductor device, base member for semico...

Method of fabricating a semiconductor device

Semiconductor device, base member for semiconductor device and semi...

Process for forming solder balls on a plate having apertures using...

Surface-mounting type semiconductor package having an improved effi...

Patents Applicationslast 30 patents

Bump-forming method using two plates and electronic device