Kazuhiko Ohashi

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-clad laminate, circuit board, and multilayer circuit board
- Patent number 10,959,330
- Issue date Mar 23, 2021
- Murata Manufacturing Co., Ltd.
- Kazuhiko Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated circuit chip bonding sheet and integrated circuit package
- Patent number 7,307,350
- Issue date Dec 11, 2007
- Japan Gore-Tex, Inc.
- Kazuhiko Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Radio frequency device
- Patent number 7,190,982
- Issue date Mar 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kouki Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric film for printed wiring board, multilayer printed board,...
- Patent number 6,849,934
- Issue date Feb 1, 2005
- Japan Gore-Tex, Inc.
- Makoto Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LCD article from liquid crystal filled, hydrophilically-coated, por...
- Patent number 5,580,618
- Issue date Dec 3, 1996
- Japan Gore-Tex, Inc.
- Kouichi Okino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board with a coverlay film
- Patent number 5,473,118
- Issue date Dec 5, 1995
- Japan Gore-Tex, Inc.
- Sunao Fukutake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite layered material containing a silicone resin substrate
- Patent number 5,294,487
- Issue date Mar 15, 1994
- Japan Gore-Tex, Inc.
- Kazuhiko Ohashi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Carrier sheet for printed circuits and semiconductor chips
- Patent number 5,252,383
- Issue date Oct 12, 1993
- Japan Gore-Tex, Inc.
- Sunao Fukutake
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Porous fluorores in material plated with a metal
- Patent number 5,190,813
- Issue date Mar 2, 1993
- W. L. Gore & Associates, Inc.
- Kazuhiko Ohashi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Metallized porous flourinated resin and process therefor
- Patent number 5,188,890
- Issue date Feb 23, 1993
- Japan Gore-Tex, Inc.
- Kazuhiko Ohashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METAL-CLAD LAMINATE, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD
- Publication number 20190357355
- Publication date Nov 21, 2019
- Murata Manufacturing Co., Ltd.
- Kazuhiko Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Radio frequency device
- Publication number 20040156178
- Publication date Aug 12, 2004
- Kouki Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric film for printed wiring board, multilayer printed board,...
- Publication number 20030219588
- Publication date Nov 27, 2003
- Makoto Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Intergrated circuit chip bonding sheet and integrated circuit package
- Publication number 20030020178
- Publication date Jan 30, 2003
- Kazuhiko Ohashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kazuhiko Ohashi

Person

Patents Grantslast 30 patents

Metal-clad laminate, circuit board, and multilayer circuit board

Integrated circuit chip bonding sheet and integrated circuit package

Radio frequency device

Dielectric film for printed wiring board, multilayer printed board,...

LCD article from liquid crystal filled, hydrophilically-coated, por...

Printed circuit board with a coverlay film

Composite layered material containing a silicone resin substrate

Carrier sheet for printed circuits and semiconductor chips

Porous fluorores in material plated with a metal

Metallized porous flourinated resin and process therefor

Patents Applicationslast 30 patents

METAL-CLAD LAMINATE, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD

Radio frequency device

Dielectric film for printed wiring board, multilayer printed board,...

Intergrated circuit chip bonding sheet and integrated circuit package