Kazuhiko Sakaguchi

Person

Hitachi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier-attached copper foil
- Patent number 8,980,414
- Issue date Mar 17, 2015
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil having glossy surface with excellent oxidation resistan...
- Patent number 6,319,621
- Issue date Nov 20, 2001
- Nikko Materials Company, Limited
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treatment method of a copper foil for printed circuits
- Patent number 5,456,817
- Issue date Oct 10, 1995
- Nikko Gould Foil Co., Ltd.
- Eiji Hino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for printed circuits
- Patent number 5,389,446
- Issue date Feb 14, 1995
- Nikko Gould Foil Co., Ltd.
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for printed circuits and process for producing the same
- Patent number 5,366,814
- Issue date Nov 22, 1994
- Nikko Gould Foil Co., Ltd.
- Keisuke Yamanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Carrier-Attached Copper Foil
- Publication number 20150086806
- Publication date Mar 26, 2015
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method f...
- Publication number 20140023881
- Publication date Jan 23, 2014
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Two-Layered Copper-Clad Laminate Material, and Method for Producing...
- Publication number 20140011047
- Publication date Jan 9, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hajime Inazumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Forming Circuit on Flexible Laminate Substrate
- Publication number 20130256006
- Publication date Oct 3, 2013
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper-Clad Laminate and Method for Manufacturing Same
- Publication number 20130252019
- Publication date Sep 26, 2013
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CARRIER-ATTACHED COPPER FOIL
- Publication number 20130216855
- Publication date Aug 22, 2013
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING CIRCUIT ON FLEXIBLE LAMINATE SUBSTRATE
- Publication number 20130001186
- Publication date Jan 3, 2013
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kazuhiko Sakaguchi

Person

Patents Grantslast 30 patents

Carrier-attached copper foil

Copper foil having glossy surface with excellent oxidation resistan...

Surface treatment method of a copper foil for printed circuits

Copper foil for printed circuits

Copper foil for printed circuits and process for producing the same

Patents Applicationslast 30 patents

Carrier-Attached Copper Foil

Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method f...

Two-Layered Copper-Clad Laminate Material, and Method for Producing...

Method for Forming Circuit on Flexible Laminate Substrate

Copper-Clad Laminate and Method for Manufacturing Same

CARRIER-ATTACHED COPPER FOIL

METHOD OF FORMING CIRCUIT ON FLEXIBLE LAMINATE SUBSTRATE