Kazuhiko Sugiura

Person

Nagoya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide semiconductor device and method for manufacturing t...
- Patent number 11,189,493
- Issue date Nov 30, 2021
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having chips attached to support members throu...
- Patent number 11,101,246
- Issue date Aug 24, 2021
- Denso Corporation
- Tomohito Iwashige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device
- Patent number 10,943,847
- Issue date Mar 9, 2021
- Mitsubishi Electric Corporation
- Kazuhiko Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,804,237
- Issue date Oct 13, 2020
- Denso Corporation
- Kazuhiko Sugiura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device
- Patent number 10,763,204
- Issue date Sep 1, 2020
- Denso Corporation
- Tomohito Iwashige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having metal silicide surround...
- Patent number 10,361,274
- Issue date Jul 23, 2019
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic component using the same
- Patent number 9,997,432
- Issue date Jun 12, 2018
- Denso Corporation
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing th...
- Patent number 9,263,267
- Issue date Feb 16, 2016
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method of th...
- Patent number 9,105,558
- Issue date Aug 11, 2015
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing th...
- Patent number 8,941,122
- Issue date Jan 27, 2015
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device
- Patent number 8,785,231
- Issue date Jul 22, 2014
- Denso Corporation
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,728,923
- Issue date May 20, 2014
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed cap
- Patent number 8,349,634
- Issue date Jan 8, 2013
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a plurality of semiconductor substra...
- Patent number 8,269,290
- Issue date Sep 18, 2012
- Denso Corporation
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,264,051
- Issue date Sep 11, 2012
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical sensor
- Patent number 8,146,426
- Issue date Apr 3, 2012
- Denso Corporation
- Kazuhiko Sugiura
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,968,958
- Issue date Jun 28, 2011
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dicing method for semiconductor substrate
- Patent number 7,901,967
- Issue date Mar 8, 2011
- Denso Corporation
- Atsushi Komura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for semiconductor device with sealed cap
- Patent number 7,859,091
- Issue date Dec 28, 2010
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor and method for manufacturing the same
- Patent number 7,821,085
- Issue date Oct 26, 2010
- Denso Corporation
- Shigenori Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for separating a semiconductor substrate into a plurality of...
- Patent number 7,662,668
- Issue date Feb 16, 2010
- Denso Corporation
- Kazuhiko Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor sensor
- Patent number 7,598,118
- Issue date Oct 6, 2009
- Denso Corporation
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-structure manufacturing method
- Patent number 7,547,642
- Issue date Jun 16, 2009
- Denso Corporation
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing movable portion of semiconductor device
- Patent number 7,214,625
- Issue date May 8, 2007
- Denso Corporation
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enhancement of membrane characteristics in semiconductor device wit...
- Patent number 7,157,781
- Issue date Jan 2, 2007
- Denso Corporation
- Eishi Kawasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electroluminescent device and method of producing the same
- Patent number 6,207,302
- Issue date Mar 27, 2001
- Denso Corporation
- Kazuhiko Sugiura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating electroluminescent device
- Patent number 6,090,434
- Issue date Jul 18, 2000
- Nippondenso Co., Ltd.
- Kazuhiko Sugiura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electroluminescent device and method for producing the same
- Patent number 5,714,274
- Issue date Feb 3, 1998
- Nippondenso Co., Ltd.
- Kazuhiko Sugiura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electroluminescent device and method for fabricating same
- Patent number 5,712,051
- Issue date Jan 27, 1998
- Nippondenso Co., Ltd.
- Kazuhiko Sugiura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for fabricating electroluminescent device
- Patent number 5,667,607
- Issue date Sep 16, 1997
- Nippondenso Co., Ltd.
- Kazuhiko Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20200312818
- Publication date Oct 1, 2020
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...
- Publication number 20190259615
- Publication date Aug 22, 2019
- DENSO CORPORATION
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190214360
- Publication date Jul 11, 2019
- DENSO CORPORATION
- Kazuhiko SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190198441
- Publication date Jun 27, 2019
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20190109067
- Publication date Apr 11, 2019
- DENSO CORPORATION
- Kazuhiko SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20180323261
- Publication date Nov 8, 2018
- Denso Corporation
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT USING THE SAME
- Publication number 20170213778
- Publication date Jul 27, 2017
- Denso Corporation
- Takeo YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...
- Publication number 20150079781
- Publication date Mar 19, 2015
- DENSO CORPORATION
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF TH...
- Publication number 20140299886
- Publication date Oct 9, 2014
- DENSO CORPORATION
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...
- Publication number 20130285070
- Publication date Oct 31, 2013
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE
- Publication number 20130178008
- Publication date Jul 11, 2013
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130102127
- Publication date Apr 25, 2013
- DENSO CORPORATION
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110147863
- Publication date Jun 23, 2011
- DENSO CORPORATION
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20100270630
- Publication date Oct 28, 2010
- DENSO CORPORATION
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of making the same
- Publication number 20100155865
- Publication date Jun 24, 2010
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device including a plurality of semiconductor substra...
- Publication number 20100065858
- Publication date Mar 18, 2010
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical quantity sensor and method for manufacturing the same
- Publication number 20090261430
- Publication date Oct 22, 2009
- DENSO CORPORATION
- Shigenori Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical sensor
- Publication number 20090199637
- Publication date Aug 13, 2009
- DENSO CORPORATION
- Kazuhiko Sugiura
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device Having Element Portion and Method of Producing...
- Publication number 20090194827
- Publication date Aug 6, 2009
- Masahiro Ogino
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20090008728
- Publication date Jan 8, 2009
- DENSO CORPORATION
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20080290490
- Publication date Nov 27, 2008
- DENSO CORPORATION
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Cap attachment structure, semiconductor sensor device and method
- Publication number 20070232107
- Publication date Oct 4, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing semiconductor sensor
- Publication number 20070117260
- Publication date May 24, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Separating device for separating semiconductor substrate and method...
- Publication number 20070111476
- Publication date May 17, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and dicing method for semiconductor substrate
- Publication number 20070111478
- Publication date May 17, 2007
- DENSO CORPORATION
- Atsushi Komura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dicing sheet frame
- Publication number 20070111484
- Publication date May 17, 2007
- DENSO CORPORATION
- Atsushi Komura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer having multiple semiconductor elements and meth...
- Publication number 20060220183
- Publication date Oct 5, 2006
- DENSO CORPORATION
- Makoto Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-structure manufacturing method
- Publication number 20060128158
- Publication date Jun 15, 2006
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for manufacturing movable portion of semiconductor device
- Publication number 20050054153
- Publication date Mar 10, 2005
- DENSO Corporation
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Enhancement of membrane characteristics in semiconductor device wit...
- Publication number 20030215974
- Publication date Nov 20, 2003
- Eishi Kawasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kazuhiko Sugiura

Person

Patents Grantslast 30 patents

Silicon carbide semiconductor device and method for manufacturing t...

Semiconductor device having chips attached to support members throu...

Semiconductor chip and semiconductor device

Semiconductor device

Semiconductor device

Silicon carbide semiconductor device having metal silicide surround...

Semiconductor device and electronic component using the same

Silicon carbide semiconductor device and method of manufacturing th...

Silicon carbide semiconductor device and manufacturing method of th...

Silicon carbide semiconductor device and method of manufacturing th...

Method of making semiconductor device

Manufacturing method of semiconductor device

Semiconductor device with sealed cap

Semiconductor device including a plurality of semiconductor substra...

Semiconductor device and manufacturing method of the same

Physical sensor

Semiconductor device and manufacturing method of the same

Dicing method for semiconductor substrate

Manufacturing methods for semiconductor device with sealed cap

Physical quantity sensor and method for manufacturing the same

Method for separating a semiconductor substrate into a plurality of...

Method of manufacturing semiconductor sensor

Micro-structure manufacturing method

Method for manufacturing movable portion of semiconductor device

Enhancement of membrane characteristics in semiconductor device wit...

Electroluminescent device and method of producing the same

Method for fabricating electroluminescent device

Electroluminescent device and method for producing the same

Electroluminescent device and method for fabricating same

Process for fabricating electroluminescent device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT USING THE SAME

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...

SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF TH...

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...

METHOD OF MAKING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device and method for manufacturing the same

Semiconductor device and method of making the same

Semiconductor device including a plurality of semiconductor substra...

Physical quantity sensor and method for manufacturing the same

Physical sensor

Semiconductor Device Having Element Portion and Method of Producing...

Semiconductor device and manufacturing method of the same

Semiconductor device and method for manufacturing the same

Cap attachment structure, semiconductor sensor device and method

Method of manufacturing semiconductor sensor

Separating device for separating semiconductor substrate and method...

Semiconductor device and dicing method for semiconductor substrate

Dicing sheet frame

Semiconductor wafer having multiple semiconductor elements and meth...

Micro-structure manufacturing method

Method for manufacturing movable portion of semiconductor device

Enhancement of membrane characteristics in semiconductor device wit...