Kazuhiro Baba

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 8,198,140
- Issue date Jun 12, 2012
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 7,816,782
- Issue date Oct 19, 2010
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate and semiconductor device
- Patent number 7,745,736
- Issue date Jun 29, 2010
- NEC Electronics Corporation
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package board using a metal base
- Patent number 7,696,007
- Issue date Apr 13, 2010
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package board using a metal base
- Patent number 7,585,699
- Issue date Sep 8, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,566,834
- Issue date Jul 28, 2009
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounting board, method of manufacturing the sa...
- Patent number 7,474,538
- Issue date Jan 6, 2009
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,397,000
- Issue date Jul 8, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate for carrying semiconductor device, method...
- Patent number 7,338,884
- Issue date Mar 4, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sheet material and wiring board
- Patent number 7,294,393
- Issue date Nov 13, 2007
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,233,066
- Issue date Jun 19, 2007
- NEC Electronics Corporation
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,060,604
- Issue date Jun 13, 2006
- NGK Spark Plug Co., Ltd.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate for carrying semiconductor device, method...
- Patent number 6,861,757
- Issue date Mar 1, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package board using a metal base
- Patent number 6,841,862
- Issue date Jan 11, 2005
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic head for recording and reproducing a signal and comprising...
- Patent number 5,930,077
- Issue date Jul 27, 1999
- NEC Corporation
- Takeshi Obata
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...
- Publication number 20110003472
- Publication date Jan 6, 2011
- NEC Corporation
- Hideya MURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE BOARD USING A METAL BASE
- Publication number 20090162974
- Publication date Jun 25, 2009
- NEC CORPORATION
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20080258283
- Publication date Oct 23, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package board using a metal base
- Publication number 20060244137
- Publication date Nov 2, 2006
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate and semiconductor device
- Publication number 20060192287
- Publication date Aug 31, 2006
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20060189125
- Publication date Aug 24, 2006
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate for mounting semiconductors, method of manufacturi...
- Publication number 20060012048
- Publication date Jan 19, 2006
- NEC CORPORATION AND NEC ELECTRONICS CORPORATION
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sheet material and wiring board
- Publication number 20050281995
- Publication date Dec 22, 2005
- Hideya Murai
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring board and semiconductor package using the same
- Publication number 20050252682
- Publication date Nov 17, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate for carrying semiconductor device, method...
- Publication number 20050130413
- Publication date Jun 16, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package board using a metal base
- Publication number 20050098875
- Publication date May 12, 2005
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device mounting board, method of manufacturing the sa...
- Publication number 20050088833
- Publication date Apr 28, 2005
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board, semiconductor package, base insulating film,...
- Publication number 20040089470
- Publication date May 13, 2004
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20040053489
- Publication date Mar 18, 2004
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate for carrying semiconductor device, method...
- Publication number 20030045024
- Publication date Mar 6, 2003
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package board using a metal base
- Publication number 20020001937
- Publication date Jan 3, 2002
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhiro Baba

Person

Patents Grantslast 30 patents

Wiring substrate for mounting semiconductors, method of manufacturi...

Wiring substrate for mounting semiconductors, method of manufacturi...

Interconnecting substrate and semiconductor device

Semiconductor package board using a metal base

Semiconductor package board using a metal base

Wiring board and semiconductor package using the same

Semiconductor device mounting board, method of manufacturing the sa...

Wiring board and semiconductor package using the same

Interconnecting substrate for carrying semiconductor device, method...

Sheet material and wiring board

Multilayer wiring substrate, and method of producing same

Multilayer wiring substrate, and method of producing same

Interconnecting substrate for carrying semiconductor device, method...

Semiconductor package board using a metal base

Magnetic head for recording and reproducing a signal and comprising...

Patents Applicationslast 30 patents

WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...

SEMICONDUCTOR PACKAGE BOARD USING A METAL BASE

WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

Semiconductor package board using a metal base

Interconnecting substrate and semiconductor device

Multilayer wiring substrate, and method of producing same

Wiring substrate for mounting semiconductors, method of manufacturi...

Sheet material and wiring board

Wiring board and semiconductor package using the same

Interconnecting substrate for carrying semiconductor device, method...

Semiconductor package board using a metal base

Semiconductor device mounting board, method of manufacturing the sa...

Printed circuit board, semiconductor package, base insulating film,...

Multilayer wiring substrate, and method of producing same

Interconnecting substrate for carrying semiconductor device, method...

Semiconductor package board using a metal base