Kazuhiro Fujisawa

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Nishitokyo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer ring supplying and returning apparatus
- Patent number 6,722,840
- Issue date Apr 20, 2004
- Kabushiki Kaisha Shinkawa
- Kazuhiro Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for securing a curved circuit board in die bonder and record...
- Publication number 20100078125
- Publication date Apr 1, 2010
- KABUSHIKI KAISHA SHINKAWA
- Noboru Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die pickup method
- Publication number 20100077590
- Publication date Apr 1, 2010
- KABUSHIKI KAISHA SHINKAWA
- Kazuhiro Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die pickup apparatus
- Publication number 20060137828
- Publication date Jun 29, 2006
- KABUSHIKI KAISHA SHINKAWA
- Kazuhiro Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer ring supplying and returning apparatus
- Publication number 20020168256
- Publication date Nov 14, 2002
- KABUSHIKI KAISHA SHINKAWA
- Kazuhiro Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS