Kazuhiro Hoshino

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Imaging device and imaging element
- Patent number 12,009,375
- Issue date Jun 11, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuhiro Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicular image capturing system and image capturing method
- Patent number 11,997,402
- Issue date May 28, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ayaka Hirata
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Imaging system, method of controlling imaging system, and object re...
- Patent number 11,863,911
- Issue date Jan 2, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image capturing device, image capturing method, and image capturing...
- Patent number 11,514,581
- Issue date Nov 29, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical thin film and manufacturing method of optical element
- Patent number 11,346,983
- Issue date May 31, 2022
- Canon Kabushiki Kaisha
- Seiken Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Image processing device, imaging device, and image processing method
- Patent number 11,244,209
- Issue date Feb 8, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image processing device, imaging device, and image processing method
- Patent number 10,885,403
- Issue date Jan 5, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imaging apparatus and imaging apparatus control method to reduce po...
- Patent number 10,863,129
- Issue date Dec 8, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image processing device, imaging device, and image processing method
- Patent number 10,217,034
- Issue date Feb 26, 2019
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Film deposition apparatus and film deposition method
- Patent number 9,951,415
- Issue date Apr 24, 2018
- Canon Tokki Corporation
- Yasuo Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing noise in image data, noise reduction unit, and...
- Patent number 8,149,302
- Issue date Apr 3, 2012
- Sony Corporation
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,985,488
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high frequency circuit, method of production and ap...
- Patent number 7,985,485
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Takami Moteki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,892,655
- Issue date Feb 22, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of processing noise in image data, noise reduction unit, and...
- Patent number 7,825,964
- Issue date Nov 2, 2010
- Sony Corporation
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,771,841
- Issue date Aug 10, 2010
- Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a solid state image pickup apparatus having...
- Patent number 7,579,576
- Issue date Aug 25, 2009
- Sony Corporation
- Toshinobu Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image pickup apparatus and control method thereof
- Patent number 7,521,656
- Issue date Apr 21, 2009
- Sony Corporation
- Toshinobu Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imaging element, imaging device, camera module and camera system
- Patent number 7,414,663
- Issue date Aug 19, 2008
- Sony Corporation
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imaging element, imaging device, camera module and camera system
- Patent number 7,375,757
- Issue date May 20, 2008
- Sony Corporation
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Copper foil for high-density ultra-fine printed wiring board
- Patent number 7,175,920
- Issue date Feb 13, 2007
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultrafine printed wiring boad
- Patent number 7,026,059
- Issue date Apr 11, 2006
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid-state image pickup apparatus and control method thereof
- Patent number 6,858,827
- Issue date Feb 22, 2005
- Sony Corporation
- Toshinobu Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image pick-up device, camera module and camera system
- Patent number 6,759,642
- Issue date Jul 6, 2004
- Sony Corporation
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device a burried wiring structure and process for fab...
- Patent number 6,395,627
- Issue date May 28, 2002
- Sony Corporation
- Kazuhiro Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact holes on a semiconductor surface
- Patent number 6,265,310
- Issue date Jul 24, 2001
- Sony Corporation
- Kazuhiro Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 6,114,764
- Issue date Sep 5, 2000
- Sony Corporation
- Kazuhiro Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising Cu--Ta and method for forming the s...
- Patent number 6,111,318
- Issue date Aug 29, 2000
- Sony Corporation
- Kazuhiro Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact hole structure in a semiconductor and formation method ther...
- Patent number 5,972,786
- Issue date Oct 26, 1999
- Sony Corporation
- Kazuhiro Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface-roughening treatment of copper foil
- Patent number 5,792,333
- Issue date Aug 11, 1998
- Circuit Foil Japan Co., Ltd.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
FILM, ELEMENT, AND EQUIPMENT
- Publication number 20220373717
- Publication date Nov 24, 2022
- Canon Kabushiki Kaisha
- Tatsuki Abe
- G02 - OPTICS
Information Patent Application
SIGNAL PROCESSING DEVICE, SIGNAL PROCESSING METHOD, PROGRAM, AND IM...
- Publication number 20220309848
- Publication date Sep 29, 2022
- Sony Semiconductor Solutions Corporation
- KAZUHIRO HOSHINO
- B60 - VEHICLES IN GENERAL
Information Patent Application
VEHICULAR IMAGE CAPTURING SYSTEM AND IMAGE CAPTURING METHOD
- Publication number 20220161728
- Publication date May 26, 2022
- Sony Semiconductor Solutions Corporation
- AYAKA HIRATA
- B60 - VEHICLES IN GENERAL
Information Patent Application
IMAGING SYSTEM, METHOD OF CONTROLLING IMAGING SYSTEM, AND OBJECT RE...
- Publication number 20220166958
- Publication date May 26, 2022
- Sony Semiconductor Solutions Corporation
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGING DEVICE AND IMAGING ELEMENT
- Publication number 20210399026
- Publication date Dec 23, 2021
- Sony Semiconductor Solutions Corporation
- KAZUHIRO HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PROCESSING DEVICE, IMAGING DEVICE, AND IMAGE PROCESSING METHOD
- Publication number 20200401859
- Publication date Dec 24, 2020
- Sony Semiconductor Solutions Corporation
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE CAPTURING DEVICE, IMAGE CAPTURING METHOD, AND IMAGE CAPTURING...
- Publication number 20200342607
- Publication date Oct 29, 2020
- Sony Semiconductor Solutions Corporation
- KAZUHIRO HOSHINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGING APPARATUS, AND IMAGING APPARATUS CONTROL METHOD
- Publication number 20190327440
- Publication date Oct 24, 2019
- Sony Semiconductor Solutions Corporation
- KAZUHIRO HOSHINO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE PROCESSING DEVICE, IMAGING DEVICE, AND IMAGE PROCESSING METHOD
- Publication number 20190147306
- Publication date May 16, 2019
- Sony Semiconductor Solutions Corporation
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL THIN FILM AND MANUFACTURING METHOD OF OPTICAL ELEMENT
- Publication number 20180306949
- Publication date Oct 25, 2018
- Canon Kabushiki Kaisha
- Seiken Matsumoto
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
IMAGE PROCESSING DEVICE, IMAGING DEVICE, AND IMAGE PROCESSING METHOD
- Publication number 20170357881
- Publication date Dec 14, 2017
- Sony Semiconductor Solutions Corporation
- Kazuhiro Hoshino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
- Publication number 20160312353
- Publication date Oct 27, 2016
- CANON TOKKI CORPORATION
- Yasuo Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAT-RESISTANT COPPER FOIL AND METHOD OF PRODUCING THE SAME, CIRCUI...
- Publication number 20120205146
- Publication date Aug 16, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL WITH RESISTANCE LAYER, METHOD OF PRODUCTION OF THE SAME...
- Publication number 20120111613
- Publication date May 10, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20110171486
- Publication date Jul 14, 2011
- THE FURUKAWA ELECTRIC CO., LTD.
- Takami MOTEKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PROCESSING NOISE IN IMAGE DATA, NOISE REDUCTION UNIT, AND...
- Publication number 20100283873
- Publication date Nov 11, 2010
- SONY CORPORATION
- Kazuhiro HOSHINO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20100270063
- Publication date Oct 28, 2010
- THE FURUKAWA ELECTRIC CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20090324988
- Publication date Dec 31, 2009
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of processing noise in image data, noise reduction unit, and...
- Publication number 20080079827
- Publication date Apr 3, 2008
- Sony Corporation
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20070154692
- Publication date Jul 5, 2007
- Furukawa Circuit Foil Co., Ltd.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultrathin copper foil with carrier and printed circuit board using...
- Publication number 20070141381
- Publication date Jun 21, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20070042212
- Publication date Feb 22, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultra-fine printed wiring board
- Publication number 20050249927
- Publication date Nov 10, 2005
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solid-state image pickup apparatus and control method thereof
- Publication number 20050174612
- Publication date Aug 11, 2005
- Sony Corporation
- Toshinobu Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Solid-state image pickup apparatus and control method thereof
- Publication number 20050173618
- Publication date Aug 11, 2005
- Sony Corporation
- Toshinobu Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Imaging element, imaging device, camera module and camera system
- Publication number 20050104991
- Publication date May 19, 2005
- Sony Corporation
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20050019599
- Publication date Jan 27, 2005
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultrafine printed wiring boad
- Publication number 20040038049
- Publication date Feb 26, 2004
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solid-state image pickup apparatus and control method thereof
- Publication number 20030052252
- Publication date Mar 20, 2003
- Toshinobu Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image pickup device, camera module and camera system
- Publication number 20010030276
- Publication date Oct 18, 2001
- Kazuhiro Hoshino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kazuhiro Hoshino

Person

Patents Grantslast 30 patents

Imaging device and imaging element

Vehicular image capturing system and image capturing method

Imaging system, method of controlling imaging system, and object re...

Image capturing device, image capturing method, and image capturing...

Optical thin film and manufacturing method of optical element

Image processing device, imaging device, and image processing method

Image processing device, imaging device, and image processing method

Imaging apparatus and imaging apparatus control method to reduce po...

Image processing device, imaging device, and image processing method

Film deposition apparatus and film deposition method

Method of processing noise in image data, noise reduction unit, and...

Ultrathin copper foil with carrier and printed circuit board using...

Copper foil for high frequency circuit, method of production and ap...

Ultrathin copper foil with carrier and printed circuit board using...

Method of processing noise in image data, noise reduction unit, and...

Ultrathin copper foil with carrier and printed circuit board using...

Method of manufacturing a solid state image pickup apparatus having...

Solid-state image pickup apparatus and control method thereof

Imaging element, imaging device, camera module and camera system

Imaging element, imaging device, camera module and camera system

Copper foil for high-density ultra-fine printed wiring board

Copper foil for high-density ultrafine printed wiring boad

Solid-state image pickup apparatus and control method thereof

Image pick-up device, camera module and camera system

Semiconductor device a burried wiring structure and process for fab...

Method of forming contact holes on a semiconductor surface

Semiconductor device and process for fabricating the same

Semiconductor device comprising Cu--Ta and method for forming the s...

Contact hole structure in a semiconductor and formation method ther...

Method of surface-roughening treatment of copper foil

Patents Applicationslast 30 patents

FILM, ELEMENT, AND EQUIPMENT

SIGNAL PROCESSING DEVICE, SIGNAL PROCESSING METHOD, PROGRAM, AND IM...

VEHICULAR IMAGE CAPTURING SYSTEM AND IMAGE CAPTURING METHOD

IMAGING SYSTEM, METHOD OF CONTROLLING IMAGING SYSTEM, AND OBJECT RE...

IMAGING DEVICE AND IMAGING ELEMENT

IMAGE PROCESSING DEVICE, IMAGING DEVICE, AND IMAGE PROCESSING METHOD

IMAGE CAPTURING DEVICE, IMAGE CAPTURING METHOD, AND IMAGE CAPTURING...

IMAGING APPARATUS, AND IMAGING APPARATUS CONTROL METHOD

IMAGE PROCESSING DEVICE, IMAGING DEVICE, AND IMAGE PROCESSING METHOD

OPTICAL THIN FILM AND MANUFACTURING METHOD OF OPTICAL ELEMENT

IMAGE PROCESSING DEVICE, IMAGING DEVICE, AND IMAGE PROCESSING METHOD

FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD

HEAT-RESISTANT COPPER FOIL AND METHOD OF PRODUCING THE SAME, CIRCUI...

COPPER FOIL WITH RESISTANCE LAYER, METHOD OF PRODUCTION OF THE SAME...

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

METHOD OF PROCESSING NOISE IN IMAGE DATA, NOISE REDUCTION UNIT, AND...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

Method of processing noise in image data, noise reduction unit, and...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

Ultrathin copper foil with carrier and printed circuit board using...

Copper foil for high frequency circuit, method of production and ap...

Copper foil for high-density ultra-fine printed wiring board

Solid-state image pickup apparatus and control method thereof

Solid-state image pickup apparatus and control method thereof

Imaging element, imaging device, camera module and camera system

Copper foil for high frequency circuit, method of production and ap...

Copper foil for high-density ultrafine printed wiring boad

Solid-state image pickup apparatus and control method thereof

Image pickup device, camera module and camera system