Kazuhiro Iizuka

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Test system and test method
- Patent number 10,019,793
- Issue date Jul 10, 2018
- TOSHIBA MEMORY CORPORATION
- Kazuhiro Iizuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stack MCP and manufacturing method thereof
- Patent number 7,833,836
- Issue date Nov 16, 2010
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack MCP and manufacturing method thereof
- Patent number 7,482,695
- Issue date Jan 27, 2009
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portion of a semiconductor apparatus mounting-position accuracy mea...
- Patent number D554084
- Issue date Oct 30, 2007
- Kabushiki Kaisha Toshiba
- Kazuhiro Iizuka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Stack MCP
- Patent number 7,285,864
- Issue date Oct 23, 2007
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method using ultrasonic flip chi...
- Patent number 6,838,316
- Issue date Jan 4, 2005
- Kabushiki Kaisha Toshiba
- Kazuhiro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEST SYSTEM AND TEST METHOD
- Publication number 20150279015
- Publication date Oct 1, 2015
- KABUSHIKI KAISHA TOSHIBA
- Kazuhiro IIZUKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSPECTION METHOD AND INSPECTION DEVICE OF INTEGRATED CIRCUIT DEVICE
- Publication number 20150070043
- Publication date Mar 12, 2015
- Kabushiki Kaisha Toshiba
- Tomokazu NAKAI
- G01 - MEASURING TESTING
Information Patent Application
SEPARATING DEVICE AND SEPARATING METHOD
- Publication number 20150064876
- Publication date Mar 5, 2015
- Kabushiki Kaisha Toshiba
- Kazuhiro IIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK MCP AND MANUFACTURING METHOD THEREOF
- Publication number 20090111218
- Publication date Apr 30, 2009
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack MCP and manufacturing method thereof
- Publication number 20070262445
- Publication date Nov 15, 2007
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack MCP and manufacturing method thereof
- Publication number 20050179127
- Publication date Aug 18, 2005
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20050026326
- Publication date Feb 3, 2005
- Mika Kiritani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method using ultrasonic flip chi...
- Publication number 20030180986
- Publication date Sep 25, 2003
- Kazuhiro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhiro Iizuka

Person

Patents Grantslast 30 patents

Test system and test method

Stack MCP and manufacturing method thereof

Stack MCP and manufacturing method thereof

Portion of a semiconductor apparatus mounting-position accuracy mea...

Stack MCP

Semiconductor device manufacturing method using ultrasonic flip chi...

Patents Applicationslast 30 patents

TEST SYSTEM AND TEST METHOD

INSPECTION METHOD AND INSPECTION DEVICE OF INTEGRATED CIRCUIT DEVICE

SEPARATING DEVICE AND SEPARATING METHOD

STACK MCP AND MANUFACTURING METHOD THEREOF

Stack MCP and manufacturing method thereof

Stack MCP and manufacturing method thereof

Manufacturing method of semiconductor device

Semiconductor device manufacturing method using ultrasonic flip chi...