Kazuhiro Ikemura

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 8,525,351
- Issue date Sep 3, 2013
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 8,018,044
- Issue date Sep 13, 2011
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 7,943,427
- Issue date May 17, 2011
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 7,501,711
- Issue date Mar 10, 2009
- Nitto Denko Corporation
- Takuya Eto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,365,441
- Issue date Apr 29, 2008
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing epoxy resin composition for semiconductor enca...
- Patent number 7,268,191
- Issue date Sep 11, 2007
- Nitto Denko Corporation
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, and semico...
- Patent number 7,265,167
- Issue date Sep 4, 2007
- Nitto Denko Corporation
- Shinya Akizuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, semiconduc...
- Patent number 7,262,514
- Issue date Aug 28, 2007
- Nitto Denko Corporation
- Keisuke Yoshikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive film for manufacturing semiconductor device
- Patent number 7,132,755
- Issue date Nov 7, 2006
- Nitto Denko Corporation
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,064,011
- Issue date Jun 20, 2006
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sealing epoxy resin composition and semiconductor dev...
- Patent number 6,410,615
- Issue date Jun 25, 2002
- Nitto Denko Corporation
- Takashi Taniguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 6,248,454
- Issue date Jun 19, 2001
- Nitto Denko Corporation
- Kazuhiro Ikemura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing semiconductor device and encapsulating pellet e...
- Patent number 5,976,916
- Issue date Nov 2, 1999
- Nitto Denko Corporation
- Makoto Kuwamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,565,709
- Issue date Oct 15, 1996
- Nitto Denko Corporation
- Takashi Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 5,294,835
- Issue date Mar 15, 1994
- Nitto Denko Corporation
- Kazumasa Igarashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC PLATE, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR...
- Publication number 20190044037
- Publication date Feb 7, 2019
- NITTO DENKO CORPORATION
- Hironaka FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20110291303
- Publication date Dec 1, 2011
- Nitto Denko Corporation
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICON...
- Publication number 20100193972
- Publication date Aug 5, 2010
- Nitto Denko Corporation
- Kazumi Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin Composition for Semiconductor Encapsulation and Semicon...
- Publication number 20080136048
- Publication date Jun 12, 2008
- Takuya Eto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20080048311
- Publication date Feb 28, 2008
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20070241445
- Publication date Oct 18, 2007
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20060145363
- Publication date Jul 6, 2006
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin composition for semiconductor encapsulation, semiconduc...
- Publication number 20050253286
- Publication date Nov 17, 2005
- NITTO DENKO CORPORATION
- Keisuke Yoshikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for producing epoxy resin composition for semiconductor enca...
- Publication number 20050154152
- Publication date Jul 14, 2005
- NITTO DENKO CORPORATION
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film for manufacturing semiconductor device
- Publication number 20050133936
- Publication date Jun 23, 2005
- NITTO DENKO CORPORATION
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20040164387
- Publication date Aug 26, 2004
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin composition for semiconductor encapsulation, and semico...
- Publication number 20040097632
- Publication date May 20, 2004
- NITTO DENKO CORPORATION
- Shinya Akizuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kazuhiro Ikemura

Person

Patents Grantslast 30 patents

Semiconductor device, substrate for producing semiconductor device...

Semiconductor device, substrate for producing semiconductor device...

Semiconductor device, substrate for producing semiconductor device...

Epoxy resin composition for semiconductor encapsulation and semicon...

Semiconductor device fabricating apparatus and semiconductor device...

Method for producing epoxy resin composition for semiconductor enca...

Epoxy resin composition for semiconductor encapsulation, and semico...

Epoxy resin composition for semiconductor encapsulation, semiconduc...

Adhesive film for manufacturing semiconductor device

Semiconductor device fabricating apparatus and semiconductor device...

Semiconductor sealing epoxy resin composition and semiconductor dev...

Epoxy resin composition for semiconductor encapsulation and semicon...

Method of producing semiconductor device and encapsulating pellet e...

Semiconductor device

Epoxy resin composition for semiconductor encapsulation and semicon...

Patents Applicationslast 30 patents

CERAMIC PLATE, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR...

Semiconductor Device, Substrate for Producing Semiconductor Device...

SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICON...

Epoxy Resin Composition for Semiconductor Encapsulation and Semicon...

Semiconductor Device, Substrate for Producing Semiconductor Device...

Semiconductor Device, Substrate for Producing Semiconductor Device...

Semiconductor device fabricating apparatus and semiconductor device...

Epoxy resin composition for semiconductor encapsulation, semiconduc...

Method for producing epoxy resin composition for semiconductor enca...

Adhesive film for manufacturing semiconductor device

Semiconductor device fabricating apparatus and semiconductor device...

Epoxy resin composition for semiconductor encapsulation, and semico...