Kazuhiro Isaka

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Tsukuba, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,458
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,457
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,252,419
- Issue date Aug 28, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 7,879,445
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board, and method of...
- Patent number 7,247,381
- Issue date Jul 24, 2007
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247867
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247874
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247873
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20090314533
- Publication date Dec 24, 2009
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for bonding circuit members, circuit board and process for...
- Publication number 20070137887
- Publication date Jun 21, 2007
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR